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Thermal and Mechanical Reliability of Five COTS MEMS Accelerometers
File Name: Thermal_and_Mechanical_Reliability.pdf | Date Submitted: 02/28/02
 

File Size:
780KB
Document Author
Reza Ghaffarian - Reza.Ghaffarian@jpl.nasa.gov
Jet Propulsion Laboratory
Phone: 818 354-2059 | FAX: 818 393-5245
[Additional User Information]

Download "Thermal and Mechanical Reliability of Five COTS MEMS Accelerometers" (780KB) Now.
 
Description:
February EEE Links PDF Format
 
Abstract:

ABSTRACT

 

Micro-electro-mechanical sensor systems (MEMS Sensors) are being considered for a variety of applications in space and launch operations. These applications include health and status monitoring, environmental monitoring, automated control, repair and service. A microaccelerometer performance was characterized in detail and their failure mechanisms were identified by subjecting them to 1,000 thermal cycles under extreme temperatures (-65 to +150°C) and to 30,000 shocks at 2,000 g. In addition, several other MEMS sensors (microaccelerometers and temperature sensors) were characterized at the extremes of their temperature ranges. It consists of a 10-day test that subjected various microaccelerometers to both continuous thermal cycling between temperatures of -40 °C and +85 °C and mechanical loading. A comparison of the data from microaccelerometers of the same type and between several types will be presented. Self-test output signals and X-ray evaluation test data after completion of 182 thermal cycles will also be presented.

 
Related Project(s):
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:
Advanced Sensors/Detectors
Newly Available Technologies and COTS
MEMS/MOEMs Reliability Assurance

 
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