+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         BACK to Publication List The Effect of Device Scaling on SEE Effects in Advanced CMOS File Name: Task 15 - Effect of Device Scaling on SEE in Advanced CMOS Devices - 102197.3.13.4 Johnston.pdf | Date Submitted: 01/23/06   File Size: 491KB Document Author Jeannette Plante - jfplante@pop500.gsfc.nasa.gov Goddard Space Flight Center Phone: None on File | FAX: None On File [Additional User Information] Download "The Effect of Device Scaling on SEE Effects in Advanced CMOS" (491KB) Now.   Description:   Abstract:     Related Project(s):   Related Area(s) of Emphasis: Radiation Hardness Assurance     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002