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Ball Grid Array Assembly Reliability - NEPP WebEx Series #3
File Name: NEPP-webex-present1-17-04A.pdf | Date Submitted: 01/28/04
 

File Size:
2629KB
Document Author
Reza Ghaffarian - Reza.Ghaffarian@jpl.nasa.gov
Jet Propulsion Laboratory
Phone: 818 354-2059 | FAX: 818 393-5245
[Additional User Information]

Download "Ball Grid Array Assembly Reliability - NEPP WebEx Series #3" (2629KB) Now.
 
Description:
 
Abstract:

Materials presented on January 27, 2004 for the NEPP Knowledge Sharing Program's WebEx (Virtual Conference) series
 
Related Project(s):
EPAC (Electronic Packaging)
 
Related Area(s) of Emphasis:
Technology Readiness Overview
High Density Packaging Technologies
Development of Innovative Qualification Methods

 
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