•Use of large high density interconnect packages, such as BGAs and high I/O QFPs, have increased with NASA hardware in recent years as well as large numbers of passive components. Boards built with these packages expensive and often require rework to replace failed component(s).
•Industry assembles high volumes of high-rel PWB’s and has numerous methods of accomplishing the rework process. Ideally, a good rework process should have a similar time-temperature profile as that used for the original production reflow.
•A survey will be conducted to document the various rework methods used by industry and NASA.
•Complete reliability assessment testing of FY’03 test vehicles.
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