+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         BACK to Publication List Embedded Passives Elements Technology (Design and Fabrication of a Functional Circuit) File Name: JPL Final Embedded Passives.doc | Date Submitted: 10/30/02   File Size: 442KB Document Author Robert (David) Gerke - David.Gerke@jpl.nasa.gov Jet Propulsion Laboratory Phone: 818 393-6372 | FAX: 818 393-4382 [Additional User Information] Download "Embedded Passives Elements Technology (Design and Fabrication of a Functional Circuit)" (442KB) Now.   Description: FY'01 Final Report for Embedded Passives Task   Abstract:   Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: Substrates and Embedded Passives Technologies Advanced Interconnect Reliability     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002