+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         BACK to Publication List Assembly Reliability of Ball Grid Array and Chip Scale Packages for High Reliability Applications File Name: RG-IEEE-3-98.pdf | Date Submitted: 10/29/01   File Size: 1026KB Document Author Reza Ghaffarian - Reza.Ghaffarian@jpl.nasa.gov Jet Propulsion Laboratory Phone: 818 354-2059 | FAX: 818 393-5245 [Additional User Information] Download "Assembly Reliability of Ball Grid Array and Chip Scale Packages for High Reliability Applications" (1026KB) Now.   Description:   Abstract: Different aspects of advanced surface mount package technology have been investigated for aerospace applications.  Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.   Related Project(s): EPAR (Electronic Parts)   Related Area(s) of Emphasis: Advanced Sensors/Detectors     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002