Abstract:
Description of Embedded Passives Technology, State of the Technology, Comparison between embedded passives and discrete passives, Advantages, Disadvantages, Applications, Producibility and Manufacturability Issues, Present Implementations, Future Implementations, Vendors, Major element materials for PCB applications, Major element materials for LTCC applications, Thin Film suppliers, General Quality and Reliability concerns, Future of integrated passives, High yielding processes, Microvia technology, High power densities, prototyping, use in Space Applications, Recommendations for NASA, References.
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