+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         BACK to Publication List Reworkability of Underfill Materials - 4th Quarter Report File Name: ReworkUnderfillMat4QRev.pdf | Date Submitted: 10/22/01   File Size: 256KB Document Author Jong Kadesch - jkadesch@orbital.com Orbital Phone: None on File | FAX: None On File [Additional User Information] Download "Reworkability of Underfill Materials - 4th Quarter Report" (256KB) Now.   Description: EPAC FY01 Task - Reworkable Underfill Characterization   Abstract: Objective  Procurement  underfill material, and two rigid boards (one with pins, and one without pins) Assembly Process  Mate two rigid boards using conductive epoxy Column Grid Array (CGA) interconnection Fill with underfill around CGA interface Test Plan  temperature cycles Destructive Physical Analysis (DPA) Removal Method Experiment   Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: Substrates and Embedded Passives Technologies Advanced Interconnect Reliability     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002