+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         BACK to Publication List Recommended PEMs Packaging Test Flow & FIT Numbers used by Candidate Manufacturers 2003 File Name: Moisture Preconditioning Recommendation.4.doc | Date Submitted: 02/18/03   File Size: 59KB Document Author Robert (David) Gerke - David.Gerke@jpl.nasa.gov Jet Propulsion Laboratory Phone: 818 393-6372 | FAX: 818 393-4382 [Additional User Information] Download "Recommended PEMs Packaging Test Flow & FIT Numbers used by Candidate Manufacturers 2003" (59KB) Now.   Description: Packaging Tests for the COTS PEMs NEPP/NEPAG Evaluation   Abstract: The NEPAG PEMs Evaluation Team asked the NEPP EPAC representatives, Dave Gerke of JPL and Jeannette Plante (DRC for GSFC) for inputs regarding the tests that should be applied to evaluate the packaging related aspects of PEMs reliability and assurance. They were also asked to research how the manufacturers of the test candidates calculate FIT rate, specifically what confidence level is used for determining sample size, and the value of the following variables, used in the Arrehnius equation, for calculating acceleration factor: base plate (or "use") temperature and activation energy. Section 1. addresses the test flow and Section 2. addresses the questions about the calculations.   Related Project(s): EPAC (Electronic Packaging) EPAR (Electronic Parts)   Related Area(s) of Emphasis: Newly Available Technologies and COTS     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002