|
Document Author
|
|
|
Download "Embedded Passives Task Summary Report" (1229KB) Now.
|
| |
Description:
Embedded Passives Final Report
|
| |
Abstract:
Embedded Passives technologies for the manufacture of substrates were investigated as a Packaging and Assembly Technology for NASA Projects. Board Manufacturers for organic printed wiring boards (PWB) and ceramic low temperature co-fired ceramic substrates (LTCC) were researched. Substrates consisting of both embedded resistor and capacitor components were designed at JPL and purchased in the two different substrate technologies. There are a very limited number of board shops that produce Hi-Rel Aerospace Quality boards/substrates with both embedded resistors and embedded capacitors. High volume commercial PWB manufacturers building boards with both embedded components exist in abundance. There are a number of good quality board shops that manufacture hi-rel boards with just one embedded component, such as resistors. The challenge here was to find manufacturers that could manufacture multiple embedded components. Embedded inductors were not investigated in this body of work.
Initial electrical measurements were taken on the resistors and capacitors of both substrates types. The results suggest that the PWB style embedded components were more consistent that the LTCC technology. It is suspected that the PWB was more accurate due to the process originating from a more high volume process; i.e. a more mature process. Future work in FY’04 will include environmental tests on the embedded substrates described in this body of work.
|
| |
Related Project(s):
EPAC (Electronic Packaging)
|
| |
Related Area(s) of Emphasis:
Substrates and Embedded Passives Technologies
Advanced Interconnect Reliability
|
Your Path: Home
»
Packaging
»
Packaging Experts
