+ View the NASA Portal NEPP Website Search   Powered By Google Your Path: Home » Packaging » Packaging Experts   Packaging Publications Index   Packaging Publications By Area of Emphasis   Packaging Links Packaging Experts   Focused Packaging Issues Portals   Search         BACK to Publication List Laser Repairable Chip On Board File Name: NEPPRCOB.pdf | Date Submitted: 09/14/01   File Size: 883KB Document Author Jeannette Plante - jfplante@pop500.gsfc.nasa.gov Goddard Space Flight Center Phone: None on File | FAX: None On File [Additional User Information] Download "Laser Repairable Chip On Board" (883KB) Now.   Description:   Abstract: Chip-on-Board (COB) packaging technology can provide a high degree of miniaturization at relatively low cost. There are risks and tradeoffs: Lack of established design rules and tools Unknown quality of die Difficulty of rework   Related Project(s): EPAC (Electronic Packaging)   Related Area(s) of Emphasis: Substrates and Embedded Passives Technologies High Density Packaging Technologies Advanced Interconnect Reliability     NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.       Last Updated: January 10, 2002