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Task Plan - 06-075a 1000 Pin Packages, CGA Evaluation
File Name: 06-075a P1-CCGA Packaging July2006B21.ppt | Date Submitted: 10/25/05

File Size:
71KB

Document Author

Reza Ghaffarian - Reza.Ghaffarian@jpl.nasa.gov
Jet Propulsion Laboratory
Phone: 818 354-2059 | FAX: 818 393-5245

[Additional User Information]

Download "Task Plan - 06-075a 1000 Pin Packages, CGA Evaluation" (71KB) Now.

Description:

Abstract:

Develop qualification guideline based on reliability test data and quality assurance indicators for high I/O CCGA packages and assemblies. Based on the program manager request, plastic packages were considered as baseline.

Related Project(s):
EPAC (Electronic Packaging)

Related Area(s) of Emphasis:
Advanced and Emerging Technologies
High Density Packaging Technologies
Advanced Interconnect Reliability

			NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.
			Last Updated: January 10, 2002