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Package induced instability in voltage reference PEMs (slides)
File Name: package induced instability in Vref.pdf | Date Submitted: 06/17/03
 

File Size:
488KB
Document Author
Alexander Teverovsky - ateverov@pop300.gsfc.nasa.gov
GSFC on-site Contractor
Phone: 301 286-9691 | FAX: None On File
[Additional User Information]

Download "Package induced instability in voltage reference PEMs (slides)" (488KB) Now.
 
Description:
Packaging related mechanical stresses are a characteristic feature of plastic packages.
 
Abstract:

Packaging related mechanical stresses are a characteristic feature of plastic packages.  The mechanical stresses are caused by shrinkage during the cure and CTE mismatch between the molding compound and the die assembly materials. Typical compressive stresses caused by packaging are 50 MPa to 100 MPa.  These stresses result in parametric shifts and mechanical damage.
 
Related Project(s):
EPAC (Electronic Packaging)
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:

Error Diagnostic Information

An error occurred while evaluating the expression: 

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Error near line 235, column 47.

The member "18133807-89F6-44CD-8B9BEF88009FB838" in dimension 1 of object "request.app.stCommon.stLUUUID2LUName" cannot be found. Please, modify the member name.

The error occurred while processing an element with a general identifier of (#request.app.stCommon.stLUUUID2LUName[currAOE]#), occupying document position (235:10) to (235:56) in the template file C:\PROGRAM FILES\ALLAIRE\SPECTRA\APPLICATIONS\NASA\HANDLERS\DOCUMENT\DISPLAY.CFM.

Date/Time: 08/29/08 19:26:31
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