This paper describes low-cost alternatives to the product assurance system for Plastic Encapsulated Microcircuits (PEMs) described in the 311-INST-001 instructions, Revision A, PEMs section, June 2002 (referred to hereafter as 311-PEM).  It might be applicable to projects working under extreme time and budget constraints and willing to accept a higher level of risk on their parts program activities (typically level 3+ projects).

The suggested qualification system is based on board-level functional testing of the parts and includes several standard elements of the qualification system, such as destructive physical analysis (DPA), special design evaluation, and innovative qualification methods.  An example of such a new method, monitored temperature transients, which is based on the local heating technique, is described.