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0607 Xilinx/NASA: The NASA Electronic Parts and Packaging (NEPP) Program (slides)
File Name: LaBel NEPP for Xilinx Status.ppt | Date Submitted: 07/13/06
 

File Size:
2655KB
Document Author
Ken LaBel - kenneth.a.label.1@gsfc.nasa.gov
Goddard Space Flight Center
Phone: 301 286-9936 | FAX: 301 286-1719
[Additional User Information]

Download "0607 Xilinx/NASA: The NASA Electronic Parts and Packaging (NEPP) Program (slides)" (2655KB) Now.
 
Description:
 
Abstract:

Presentation given at the NASA GSFC June 26, 2006 Open Forum on Xilinx FPGA's
 
Related Project(s):
EPAC (Electronic Packaging)
ERC (Electronic Radiation Characterization)
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:
High Performance Processor and Memory Technologies
Advanced and Emerging Technologies
Newly Available Technologies and COTS

 
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