The JESD22-A113C Test Method establishes an industry standard preconditioning flow for non-hermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. SMDs are subjected to the appropriate preconditioning sequence of the specification by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow). The reliability numbers published by the manufacturers reflect a composite of stresses which include those from both the preconditioning test flow and the qualification test flow. This Qualification Validation is one portion of the overall packaging-related test plan which is a subset evaluation of the larger NEPP/NEPAG PEMS study.