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Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (paper)
File Name: The significance of Tg 3.pdf | Date Submitted: 11/12/03
 

File Size:
161KB
Document Author
Alexander Teverovsky - ateverov@pop300.gsfc.nasa.gov
GSFC on-site Contractor
Phone: 301 286-9691 | FAX: None On File
[Additional User Information]

Download "Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (paper)" (161KB) Now.
 
Description:
The transition of epoxy molding compounds from a glassy to rubbery state drastically changes thermal, mechanical, and electrical characteristics of molding compounds.
 
Abstract:
Reliability evaluation and screening of COTS PEMs for military and aerospace applications necessitates stress testing of the parts at highest allowable temperatures. The transition of epoxy molding compounds from a glassy to rubbery state drastically changes thermal, mechanical, and electrical characteristics of molding compounds and conceivably might introduce new failure mechanisms thus limiting the maximum stress temperatures. In this work molding compounds in different plastic encapsulated devices have been characterized using a thermo-mechanical analyzer. The results of Tg measurements are compared with the rated temperatures of the parts and results of burn-in, temperature cycling, high temperature storage, and highly accelerated humidity stress testing. Analysis shows that exceeding Tg during standard screening and qualification testing does not cause failures in normal quality lots of PEMs.
 
Related Project(s):
EPAC (Electronic Packaging)
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:

Error Diagnostic Information

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Date/Time: 08/29/08 19:10:31
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