Plastic encapsulated microcircuits (PEM) are molded, potted, or coated semiconductor die or hybrid integrated circuits in which the encapsulant or coating is in direct contact with the die, leadframe and/or signal traces, interconnects, and barrier layers of the device.  Hermetically sealed microcircuits (HSM) have a sealed cavity and the die, leadframe and/or signal traces, interconnects, and barrier layers are not in contact with the metal and/or ceramic package. PEMs are a subset of plastic encapsulated microelectronics, but these terms are used interchangeably in most cases.  The purpose of this paper is to identify issues which must be addressed when determining whether the use of PEMs is acceptable

in the desired application in military equipment.