Abstract:
A work request was submitted to the GSFC Parts Analysis Lab for developing
destructive physical analysis (DPA) procedure on plastic encapsulated microcircuits (PEMs).
This study is the second investigation performed by the GSFC PA Lab aimed at an
understanding of PEM construction features and peculiarities and to develop the capability to
evaluate these features and perform failure analyses (see report PP54735).
This work presents recommendations for DPA procedures on PEM and indicates which
of the techniques require further development.
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