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In-situ Measurements of Thermo-Mechanical Characteristics of Molding Compounds in PEMs
File Name: In-situ measurements of thermo-mechanical.pdf | Date Submitted: 09/02/03
 

File Size:
2280KB
Document Author
Alexander Teverovsky - ateverov@pop300.gsfc.nasa.gov
GSFC on-site Contractor
Phone: 301 286-9691 | FAX: None On File
[Additional User Information]

Download "In-situ Measurements of Thermo-Mechanical Characteristics of Molding Compounds in PEMs" (2280KB) Now.
 
Description:
Temperature dependencies of package deformation were measured on various plastic encapsulated microcircuits.
 
Abstract:
The glass transition temperature, Tg, and coefficients of thermal expansion in a glassy state, CTE1, and rubbery state, CTE2, are important characteristics of molding compounds, which affect thermo-mechanical performance and reliability of electronic devices encapsulated in plastics. Temperature increase above Tg of epoxy molding compounds might significantly degrade electrical and mechanical characteristics of encapsulating materials and thus limit maximum stress temperatures during screening and qualification of COTS PEMs. This requires thermo-mechanical characterization of molding compounds in each lot of commercial parts intended for military and aerospace applications. In this work temperature dependencies of package deformation were measured on various plastic encapsulated microcircuits to evaluate Tg and CTE of molding compounds. It is shown that these measurements can result in significant errors due to warpage of the package, moisture content, and internal mechanical stresses. A standardized procedure for Tg and CTE measurements on plastic packages is suggested. Several examples of application of thermo-mechanical characterization of plastic packages for failure analysis of plastic encapsulated microcircuits and discrete semiconductor devices are considered.
 
Related Project(s):
EPAC (Electronic Packaging)
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:

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