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Mrs. Jong Kadesch
[PACKAGING ENGINEER]

Contact Information:
jkadesch@orbital.com

Organization/Employer:
Orbital
http://www.orbital.com
7500 Greenway Center Dr.
Suite 700
Greenbelt, Maryland 20770
301-220-5600

Authored Publications:

1.	Processes for Utilizing Laser Machined Metallized Polyimide for Electronic Circuit Applications
	Task Deliverable \| File Size: 243KB \| File Date:
2.	Technology Readiness overview: Pb-Free Solder Alloy Investigation
	Task Deliverable \| File Size: 15039KB \| File Date:
3.	Reliability of Lead (Pb)-Free Solder Alloy
	Presentation \| File Size: 3983KB \| File Date: 10/15/02
4.	Effect of Conformal Coat on Tin Whisker Growth
	Whitepaper \| File Size: 1397KB \| File Date: 9/1/00
5.	Evaluation of the Die Attachment, Ablestik 84-1, for its Reliability for TDRS, September 1998
	Evaluation Report \| File Size: 2418KB \| File Date: 9/1/98
6.	Reworkability of Underfill Materials - 4th Quarter Report
	Task Deliverable \| File Size: 256KB \| File Date: 10/10/01
7.	Plastic Encapsulated Microcircuit (PEM) Guidelines for Screening and Qualification for Space
	PEMs Guidelines \| File Size: 194KB \| File Date: 1/3/97

This User is a member of the NEPP Experts List

Area(s) Of Expertise:
Lead Free Electronics

			NEPP Program Manager: Michael J. Sampson Responsible NASA Official: Michael J. Sampson Webmaster: Carl M. Szabo, Jr.
			Last Updated: September 05, 2008