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Document Author
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Download "Advanced Packaging of Image Sensors" (388KB) Now.
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Description:
2nd Annual NEPP Conference
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Abstract:
- Special requirements for image sensor packaging
- Traditional packaging for digital still cameras
- Additional requirements for wireless handset camera modules
- Case #1 - Encapsulated package
- Case #2 - Chip scale package
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Related Project(s):
EPAC (Electronic Packaging)
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Related Area(s) of Emphasis:
High Density Packaging Technologies
Advanced Sensors/Detectors
Photonic Systems and Devices
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