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Environmentally Induced Swelling and Shrinkage of Molding Compounds in PEMs
File Name: Swelling and Shrinkage 3.doc | Date Submitted: 10/15/02
 

File Size:
3937KB
Document Author
Alexander Teverovsky - ateverov@pop300.gsfc.nasa.gov
GSFC on-site Contractor
Phone: 301 286-9691 | FAX: None On File
[Additional User Information]

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Description:
Paper analyzes the shrinking and swelling of PEMs
 
Abstract:
 

This work analyzes swelling and shrinkage of plastic packages of PEMs caused by various environmental conditions.  These conditions include moisture sorption during normal storage in laboratory conditions, accelerated environmental stress testing in humidity chambers, bake-outs at 125 oC and 150 oC, and short-term high temperature exposure at temperatures above 200 oC simulating soldering processes.  The volume deviations in molding compounds and plastic packages of microcircuits were measured using a simple hygrostatic weighting technique.

Several types of plastic encapsulated microcircuits (PEMs) and encapsulating materials have been evaluated.  The coefficients of moisture expansion (CME) were found to depend on moisturizing conditions, increasing with temperature and relative humidity above 60% RH.  Saturation with moisture at 85 oC/85% RH resulted in the CME varying for different molding compounds from 0.1 to 0.49.  The extent of deformations caused by moisture removal (baking out) in the samples stored for a long time at normal conditions (T » 22 oC, RH » 50%) was comparable with the deformation caused by swelling in high humidity environments.  Depending on the type of molding compound used, initial moisture content, and temperature of bake, baking of PEMs can result either in increase or in decrease of the volume of the package.  Exposure to high temperatures causes significant reduction of the volume of plastic packages.  Different physical mechanisms of environmental effects causing swelling and shrinkage of plastic packages in PEMs are discussed.
 
Related Project(s):
EPAC (Electronic Packaging)
EPAR (Electronic Parts)
 
Related Area(s) of Emphasis:

Error Diagnostic Information

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Date/Time: 08/20/08 16:41:44
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