In a collaborative effort between NASA Glenn Research Center (GRC), NASA Langley Research Center (LaRC), and the Jet Propulsion Laboratory (JPL) under the NASA Electronic and Packaging Program (NEPP), two different flexible printed circuit boards were designed and built by NASA LaRC.  Each board comprised of a three-layer laminated structure of Soluble Imide (LaRC -SI) insulating material film with seven serpentine-like copper traces sandwiched between them.  The first printed circuit board (board #1) had only the LaRC-SI film as the main insulation media, while the other printed circuit board (board #2) consisted of a mix of the LaRC-SI film and boron nitride. The addition of boron nitride was to facilitate structural or other temperature-induced changes such as delamination or modification in the electrical properties of the circuit board. Fabrication of the boards and the processing techniques used were described in detail in a published report [1]. These boards were delivered to NASA GRC for in-house evaluation under wide temperature cycling.  Photographs of board #1 and board #2 are shown in Figures 1 and 2, respectively.  It is anticipated that the results of these investigations will help in understanding the effects of extreme temperature exposure and thermal cycling on the integrity and the functionality of these boards and thereby steps can be taken in the design and construction of reliable printed circuit boards for operation in extreme temperature environments.