| Keynote Presentation |
Making Electronic Parts and Packaging Technology Viable for Flight Projects
Richard Brace
Jet Propulsion Lab |
| Advanced Electronics Materials |
Controlled PEMS, A High Density Packaging Solution for Space
Mary C. Massey, William C. McMullen, Wennei Chen, Brian E. Parrish, Zoltan A. Szalontai
TRW Electronics and Technology Division |
Langley Research Center - Soluble Imide (LaRC-SI) Bonding ExperimentJames Bockman, Nancy Holloway, Rob Bryant, Kevin Barnes
NASA Langley Research Center |
No-Clean Assembly Process Conditions - Effects on Flip-Chip/Underfill Reliability
Michael Todd and Kathryn Costello
Loctite/Dexter Electronic Materials |
| Advanced Manufacturing Processes |
Different Modes of Surface Passivation of GaAs
Tarak A. Raikar
Conexant Systems, Inc.
Ajay P. Malshe, Rajesh Bhide, Shiva Hullavarad, and S.V. Bhoraskar
Department of Physics, University of Pune, India |
Packaging Solution for Next Generation Products
Han-Ping Pu, Tzong-Dar Her, C.Y. Lin
Siliconware Precision Industries Co., Ltd., Taiwan, R.O.C. |
Advanced Packaging of Image Sensors
Usama Abdali
Conexant |
| Advanced Technologies |
Microwave End Product Board Inspection and Test
Rene Martinez
TRW
|
|
Space Qualification Plan of Optoelectronic and Photonic Devices for Optical Communication Systems
Quiesup Kim, Jet Propulsion Lab
Kargaret L. Tume, NASA Glenn Research Center
Carl Magee, NASA Langley Research Center
|
| Extreme Environments |
Development And Application Of High Temperature Sensors And Electronics
Gary Hunter
ghunter@grc.nasa.gov
NASA Glenn Research Center |
Experience With Plastic Part Evaluations at Cold Temperatures
Mike Sandor and Shri Agarwal
Jet Propulsion Lab |
Packaging Technology for 500?SiC Microsystems
Liang-Yu Chen, Gary Hunter, and Philip Neudeck
NASA Glenn Research Center |
Silicon Carbide (SiC) and Silicon-on-Insulator (SOI) Electronics for Harsh Environmental Applications
Krishna Shenai
University of Illinois, Chicago
|
| Embedded Passives |
Embedded Passives in Space
Robert Graber
Jet Propulsion Lab |
Integral Heater for Reworking High Density Interfaces
Mary C. Massey, William E. McMullen, and Ryan S. Berkley
TRW Electronics and Technology Division
Susheel Dharia and Aki Nomura
Kyocera America, Inc. |
| High Density Packaging and Interconnection Technologies |
Inspection of Hidden Solder Connections
John Denning
TRW Space and Electronics Group
Silicon Based SiP Beyond SoC
Martin Goetz
Alpine Microsystems
mgoetz@alpinemicro.com |
| Microelectronics Reliability |
Effects of Via-Conductor Orientation in the Electromigration Failure of AI:Cu Wires
Rosa Leon
Jet Propulsion Lab |
Hot-Carrier Degradation of 2-Volt Silicon-On-Insulator (SOI) Transistors
Udo Lieneweg
Jet Propulsion Lab |
Performance of Rad-Hard Quad Receivers at Extreme Temperatures
Quiesup Kim, Shri G. Agarwal, and Tetsuo F. Miyahira
Jet Propulsion Lab |
| Quality and Reliability Systems |
Current Silicon Die Thinning and Bonding onto Membranes Technologies for Solar Sails - An Overview
Abstract Presentation
W. Sokolowski and S. A'Agostino
Jet Propulsion Lab |
|
Virtual Qualification of Electronic Hardware
Dr. Michael Osterman
CALCE Electronic Products and Systems Center
University of Maryland
|
A General Approach to MEMS Reliability Assurance
Joanne Wellman
Jet Propulsion Lab |
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2001NEPP Conference Procedings