Online calculation tools and web resources supported by ESCML:

Embedded Passives Cost Modeling Tool  (CALCE Members and NIST AEPT Members Only - password required) 
Embedded Passives Cost Modeling Tool Public Description and Walkthrough
- This model provides an application-specific economic analysis of the conversion of discrete passive components (resistors and capacitors) to integral passives that are embedded within a printed circuit board. The model performs three basic analyses: 1) Board size analysis is used to determine board sizes, layer counts, and the number of boards that can be fabricated on a panel; 2) Panel fabrication cost modeling including a cost of ownership model is used to determine the impact of throughput changes associated with fabricating integral passive panels; and 3) Assembly modeling is used to determine the cost of assembling all discrete components, and their associated inspection and rework. 
Design Refresh Planning (MOCA)
- MOCA (Mitigation of Obsolescence Cost Analysis) is a design tool for determining the part obsolescence impact on life cycle sustainment costs for the long field life electronic systems based on future production projections, maintenance requirements and part obsolescence forecasts. Based on a detailed cost analysis model, the methodology determines the optimum design refresh plan during the field-support-life of the product. The design refresh plan consists of the number of design refresh activities, their respective calendar dates and content to minimize the life cycle sustainment cost of the product. The methodology supports user determined short- and long-term obsolescence mitigation approaches on a per part basis, variable look-ahead times associated with design refreshes, and allows for inputs to be specified as probability distributions that can vary with time. Outputs from this analysis are used as inputs to the PRICE Systems PRICE H/L commercial software tools for predicting life cycle costs of systems.

Single Test Step  
- This calculator allows users to input the cost and yield of parts entering a test activity.  The test activity can be characterized by a test cost, fault coverage, and test yield (defects introduced in the test process).  The calculator computes the outgoing cost and yield after testing.  Simple plot creation is also available within the tool.  

Test/Diagnosis/Rework Process  
- This calculator is an expanded version of the single test step calculator above.  It allows users to input the cost and yield of parts entering a test/diagnosis/rework activity.  The test activity can be characterized by a test cost, fault coverage, fraction of false positives and test yield; the diagnosis activity can be characterized using a diagnosis cost and a fraction of parts that are diagnosable; and the rework activity can be characterized with a rework cost, rework yield, and fraction of parts reworkable.  Users can control the number of rework attempts on a particular part.  The calculator computes the outgoing cost and yield after the test/diagnosis/rework process. 

CALCE Consortium Return and Investment (ROI) Calculator
- To aid CALCE members in a simple assessment of their CALCE membership ROI based on the equivalent cost of reproducing the value delivered by CALCE, a simple ROI calculator has been developed.

Escape Routing Calculator  (CALCE Members Only - password required)
- A limiting requirement for some parts is escape routing. If a part's I/O are in an area array format (as opposed to peripherally bonded), the part can not be wired into the system until all of its I/O are routed out from under the part. This situation is encountered for flip chip bonded die and die in various array format chip scale packages such as BGAs (Ball Grid Arrays). The process of liberating I/O from an array is called escape routing.  This calculation tool can be used to: a) determine whether a specific part can be escape routed when interconnected to a specific board technology, and b) determine the footprint occupied by the part on the top layer of the board. 

Contract Assembly Webbook (CALCE Members Only - password required)
- The growth in popularity of contract assembly outsourcing in the electronics industry and the absence of concrete procedures for the outsourcing process, formed the motivation for this work. Contract outsourcing involves the transfer of specific assembly activities related to a product or process from an OEM (Original Equipment Manufacturer) to a CA (Contract Assembler). This web site presents industry outsourcing data from the top OEMs and CAs, step-by-step procedures for performing benchmarking and the management of the CA, the economics of outsourcing, and several case studies of large OEMs that have successfully performed outsourcing of electronics assembly activities.