·  Accelerated Product Qualification and Quality Assurance (Description) 

·  Circuit Card Assemblies Failure Mechanism Handbook (Description) 

·  Component Knowledge Base 

·  Contract Assembly Assessment (Description) 

·  Electronics Industry in Asia 

·  Electronic Packaging Materials and Their Properties (Description) 

·  EMC / EMI 

·  Escape Routing and Footprint Analysis (Description) 

·  Guidebook for Managing Silicon Chip Reliability (Description) 

·  High Density Interconnect 

·  High Temperature Electronic Packaging (Description) 

·  Influence of Temperature on Microelectronics and System Reliability (Description) 

·  Integrated Circuit, Hybrid and Multichip Module Package Design Guidelines (Description) 

·  Integral Passives (Description) 

·  Liquid Crystal Displays: Performance and Reliability (Description) 

·  Long-Term Non-Operating Reliability of Electronic Products (Description) 

·  Microelectronic Defects Database (Description) 

·  Moisture Diffusion and Corrosion in Electronics (Description) 

·  Plastic Encapsulated Microelectronics (Description) 

·  Power Electronics Failure Mechanisms Database (Description) 

·  Printed Wiring Board (PWB) Manufacturing (Description) 

·  Quality Conformance and Qualification of Microelectronic Packages and Interconnects (Description) 

·  Root Cause Identification for Failure in PWBs (Description) 

·  Microsensor Technology Review for Life-Consumption Monitoring (Description)