| |
Project Publications |
| 1. |
0607 Xilinx/NASA: Meeting Schedule
|
| 2. |
0607 Xilinx/NASA: Assembly Reliability for Two CCGA Packages (slides)
|
| 3. |
0607 Xilinx/NASA: The NASA Electronic Parts and Packaging (NEPP) Program (slides)
|
| 4. |
0607 Xilinx/NASA: SpaceCube IRAD Development Effort (slides)
|
| 5. |
3D Packaging Report 071805
|
| 6. |
3rd NEPP Workshop Program Guide
|
| 7. |
A Rapid Technique for Moisture Diffusion Characterization of Molding Compounds in PEMs
|
| 8. |
A Study to Determine the Thermal Characteristics of COTS Boards and Their Behavior in Vacuum
|
| 9. |
A Systems Approach for Quality and Reliability of Chip Scale Package Assembly
|
| 10. |
A Technique for Assessing the Moisture Resistance of PEMs Using MOS Test Structures
|
| 11. |
Accelerated Thermal and Mechanical Testing of CSP
|
| 12. |
Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies
|
| 13. |
Acoustic Microscopy, a Tool for Evaluating Quality of Microelectronics
|
| 14. |
Advanced Adhesion and Bonding
|
| 15. |
Advanced Packaging of Image Sensors
|
| 16. |
AFMC COTS Guide - 1993
|
| 17. |
Analysis of Plastic Parts Package Delamination
|
| 18. |
APPLICATION OF THERMO-MECHANICAL MEASUREMENTS OF PLASTIC PACKAGES FOR RELIABILITY EVALUATION OF PEMS
|
| 19. |
Assembly and Cleaning of CSPs for High, Low, and UltraLow Volume Applications
|
| 20. |
Assurance of COTS Boards for Space Flight
|
| 21. |
Assurance of COTS Boards for Space Flight - Part I
|
| 22. |
Assurance of COTS Fiber Optic Cable Assemblies for Space Flight
|
| 23. |
Ball Grid Array Assembly Reliability - NEPP WebEx Series #3
|
| 24. |
Ball Grid Array Reliability Assessment for Aerospace Applications
|
| 25. |
BOK of Applications of Wireless Data Systems in High Temperature Environments
|
| 26. |
CAVE - Overview of Lead Free Solder Research
|
| 27. |
Challenges with PEMS Found in the MMEM Study - Rockwell Study (slides)
|
| 28. |
Characteristic Times of Moisture Diffusion and Bake-out Conditions for Plastic Encapsulated Parts
|
| 29. |
Characterization of a Twelve Channel Optical Fiber, Ribbon Cable and MTP Array Connector Assembly...
|
| 30. |
Chip Scale Package Implementation Challenges
|
| 31. |
Chip-Scale Package Reliability-Has it Been Proven?
|
| 32. |
Chlorine contamination diffusion in silicones
|
| 33. |
Choosing the Right Lead-Free Solder
|
| 34. |
Close the Information Gap on IC-Package Reliability
|
| 35. |
CO1-34 Report: Effect of Proof Testing on Optical Fiber Fusion Splices
|
| 36. |
Command and Data Handling in Your Palm
|
| 37. |
Commercial off the shelf for LHS experiments.pdf (slides)
|
| 38. |
Commercial Tree of HBTs
|
| 39. |
Commercial-Off-The-Shelf Microelectromechanical Systems
|
| 40. |
Concerns About Commercial Component Obsolecense in Commercial Aircraft 1998 (slides)
|
| 41. |
Conducting Polymers and the Evolving Electronics Technology
|
| 42. |
Conductivity Measurements Made on LARC-SI and Kapton Polyimides for Space Applications
|
| 43. |
Controlled PEMs A High Density Packaging Solution for Space.pdf
|
| 44. |
COTS Boards Insertion Methodology and Plan, Draft, August 1998
|
| 45. |
COTS PEMs Procurement/Acquisition Concerns and Issues
|
| 46. |
CSP Assembly Reliability: Commercial and Harsh Environments
|
| 47. |
CSP Reliability for Single- and Double-Sided Assemblies
|
| 48. |
Descripton of the Fabrication Process for LARC-SI Multi-Layered Flex Circuits
|
| 49. |
Design and Electrical Test Procedure for GIFTS LaRC-SI Flex Circuit
|
| 50. |
Detection of Outgassing Species from the Electrical Insulators Using Cyranose E-Nose
|
| 51. |
Diamond as a Microelectronic Material with Potential for Space Applications, September 1998
|
| 52. |
Die Attach Technology to Reduce Die Stresses in MEMs Pressure Sensors
|
| 53. |
Does Red Phosphorus in Molding Compounds for Electronic Devices Present a Reliability Risk?
|
| 54. |
DPA Guide for PEMs - Draft
|
| 55. |
Dynamic Stress Analysis of TSOP Devices with Different Chip Sizes
|
| 56. |
EEE Links Article: Evaluation of Laminated Flexible PCBs Under Wide Temperature Cycling
|
| 57. |
EEE Links January 2003
|
| 58. |
EEE Links Volume 10 No. 2 Apr. 2004
|
| 59. |
Effect of Conformal Coat on Tin Whisker Growth
|
| 60. |
Effect of Extreme Environmental Thermal Cycling on COTS MEMS Pressure Sensor
|
| 61. |
Effect of Extreme Temperature Cycling of PDIP-8 OP181 Op Amp
|
| 62. |
Effect of Vacuum on High Temperature Degredation of Gold/Aluminum Wire Bonds in PEMs
|
| 63. |
Effect of Vacuum on High-Temperature Degradation of Au-Al Wire Bonds in PEMS
|
| 64. |
Effects of Wide Temperature Thermal Cycling on Flexible Laminated Printed Circuit Boards
|
| 65. |
Electron Induced Scintillation Testing of Commercially Available Optical Fibers for Space Flight
|
| 66. |
Embedded Passives Elements Technology (Design and Fabrication of a Functional Circuit)
|
| 67. |
Embedded Passives Final Report1
|
| 68. |
Embedded Passives in Space (slides)
|
| 69. |
Embedded Passives Task Summary Report
|
| 70. |
Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: Presentation
|
| 71. |
Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: White Paper
|
| 72. |
Environmental Stress Testing of Power Transistors Encapsulated in Plastic Packages
|
| 73. |
Environmentally Induced Swelling and Shrinkage of Molding Compounds in PEMs
|
| 74. |
ESD Testing of an EEPROM-Based Multichip Module
|
| 75. |
EV61261_LT1014IS
|
| 76. |
EV72015_LT1014IS
|
| 77. |
EV78074_58V1001T25
|
| 78. |
Evaluation of 3D Plus Test Structures
|
| 79. |
Evaluation of ESD Effects During Removal of Conformal Coatings Using Micro Abrasive Blasting, 10/97
|
| 80. |
Evaluation of Flexible Laminated Printed Circuit Boards Under Wide Temperature Cycling
|
| 81. |
Evaluation of Laminated Flexible Printed Circuit Boards Under Wide Temperature Cycling
|
| 82. |
Evaluation of Non-Evaporable Getters for High Vacuum Hermetic Packages
|
| 83. |
Evaluation of the Die Attachment, Ablestik 84-1, for its Reliability for TDRS, September 1998
|
| 84. |
Evaluation of Vertical Cavity Surface Emitting Lasers (VCSEL) mounted on CVD Diamond Substrates
|
| 85. |
Executive Summary CVD Diamond Film Project WPI Major Qualifying Project
|
| 86. |
FEA Stress Analysis for the Comparison of BGA and CGA
|
| 87. |
Fiber Optic Cable Assemblies for Space Flight Applications - Issues and Remedies
|
| 88. |
Fiber Optic Cable Assemblies for Space Flight Applications - Issues and Remedies, Viewgraphs
|
| 89. |
Fiber Optic Cable Assemblies for Space Flight Applications III: Characterization of Commercial Cable
|
| 90. |
Fiber Optic Cable Assemblies for Space Flight II - Thermal and Radiation Effects
|
| 91. |
Fiber Optic Cable Assemblies for Space Flight II - Thermal and Radiation Effects (AEIS Conf)
|
| 92. |
Fiber Optic Cable Assemblies for Space Flight II - Thermal and Radiation Effects (JPL Pckg WShp)
|
| 93. |
Fiber Optic Epoxy Outgassing Study for Space Flight Applications
|
| 94. |
Fiber Optic System Qualification at Goddard Space Flight Center
|
| 95. |
Fiscal Year 2002 NEPP Tasks
|
| 96. |
Fundamentals of Microelectromechanical Systems - Part 1 of 3
|
| 97. |
Fundamentals of Microelectromechanical Systems - Part 2 of 3
|
| 98. |
Fundamentals of Microelectromechanical Systems - Part 3 of 3
|
| 99. |
Getters for Reliable Hermetic Packages
|
| 100. |
GIFTS 5-Layered Circuit
|
| 101. |
GLAST LAT Project Parts and Mission Assurance Requirements (slides)
|
| 102. |
Gold-Indium Intermetallic Compounds: Properties and Growth Rates
|
| 103. |
GSFC Parts Engineering in COTS PEMs era (slides)
|
| 104. |
Guidebook on the Use of PEMs at High Altitudes (slides)
|
| 105. |
High Density Microelectronics Packaging Roadmap For Space Applications 2001
|
| 106. |
High Density Microelectronics Packaging Roadmap for Space Applications 2003
|
| 107. |
High Density Microelectronics Roadmap for Aerospace Applications 2003
|
| 108. |
High Speed Fiber Optics Test Bed Network Technologies Investigation
|
| 109. |
Historical: Draft Specification for Optical Cable for Space Flight I
|
| 110. |
Historical: Draft Specification for Optical Cable for Space Flight II
|
| 111. |
Historical: Draft Specification for Optical Cable for Space Flight IV
|
| 112. |
Hybrid Supplier Assessment Checklist
|
| 113. |
Image of LARC-SI Flex Circuit Fabrication Flow
|
| 114. |
Impact of Print Parameters and CSP Pitch and I/O on Paste Quality and Volume
|
| 115. |
Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (paper)
|
| 116. |
In-situ Measurements of Thermo-Mechanical Characteristics of Molding Compounds in PEMs
|
| 117. |
Inspection of Hidden Solder Connections
|
| 118. |
Integral and Integrated Passives Webbook Update - Part 1
|
| 119. |
Integral and Integrated Passives Webbook Update - Part 2
|
| 120. |
Integral and Integrated Passives Webbook Update - Part 3
|
| 121. |
Integral Heater for Reworking High Density Interfaces
|
| 122. |
Intermetallic Issues with Wire Joining by Thermocompression and Soldering
|
| 123. |
INTRODUCING A NEW MEMBER TO THE FAMILY: GOLD WHISKERS
|
| 124. |
IPPAQ Optoelectronics Survey Results
|
| 125. |
IPPAQ: Reliability of Optical Fiber Modulators for Space Flight Environments
|
| 126. |
ISS FIber Optic Failure Investigation Root Cause Report
|
| 127. |
Issues Concerning the Replacement of Lead in Hi-Rel Electronic Applications
|
| 128. |
JPL's Guide to Plastic COTS Parts (slides)
|
| 129. |
Langley Research Center - Soluble Imide (LaRC-SI) Bonding Experiment
|
| 130. |
LaRC Si-Environment
|
| 131. |
Laser Repairable Chip On Board
|
| 132. |
Lead-Free Soldering for Space Applications TRO/BKO (Appdx's Only)
|
| 133. |
Lead-Free Soldering for Space Applications TRO/BKO (w/o Appdx's)
|
| 134. |
Lessons Learned from Screening and Qualification of COTS PEMs for Space Applications (slides)
|
| 135. |
Low Temperature Testing of JPL BGA Board #1
|
| 136. |
Low-Temperature Electronics for Space & Terrestrial Applications - NEPP Webex Series #2
|
| 137. |
Manufacturing Robustness of CSP on an SMT Line
|
| 138. |
Measurements of Thermo-Mechanical Characteristics of PEMs for Failure Analysis and Reliability Evalu
|
| 139. |
Moisture Characteristics of Molding Compound and Environmental Effects in PEMs (slides)
|
| 140. |
Moisture Characteristics of Molding Compounds in PEMs (slides)
|
| 141. |
Moisture diffusion in molding compounds and quality assurance of PEMs for space applications
|
| 142. |
Moisture effects in PEMs intended for space applications (slides)
|
| 143. |
Moisture-related failures of operational amplifiers in plastic packages
|
| 144. |
Monte Carlo Simulation of BGA Failure Distributions for Virtual Qualification
|
| 145. |
NASA Guidelines for Ball Grid Array Selection and Use
|
| 146. |
NASA Techn Brief: Tailoring Cores of Optical Fibers by a Sol-Gel Method
|
| 147. |
NEPP Conference 2002 Final Program
|
| 148. |
NEPP News Flash - November 2001
|
| 149. |
NEPP News Flash - October 2002
|
| 150. |
No-Clean Assembly Process Conditions - Effects on Flip-Chip/Underfill Reliability
|
| 151. |
Notes on the Reliability of The HST Gyros
|
| 152. |
On the Suitability of Fiber Optic Data Links in the Space Radiation Environment
|
| 153. |
Optical Fiber Cable Assembly Characterization for the Mercury Laser Altimeter (MLA)
|
| 154. |
Optical Inspection of ADI OP Amp Packages Before and After Thermal Cycling (-125oC to 90oC
|
| 155. |
Package induced instability in voltage reference PEMs (slides)
|
| 156. |
Package Qualification Testing Results Performed on the 5 Part Types in the NEPP/NEPAG PEMS Study
|
| 157. |
Packaging of High Temperature SiC Based Electronics
|
| 158. |
Packaging Technology for 500° SiC Microsystems
|
| 159. |
PEM-INST-001 Instructions for Plastic Encapsulated Microcircuit (PEM) Select, Screen, & Qualify
|
| 160. |
PEMs Research
|
| 161. |
PEMS-INST-001 (pointer)
|
| 162. |
Photonic Integration and Usage Guidelines Manual D-18228
|
| 163. |
Photonic Validation Methods Handbook D-18230
|
| 164. |
Plastic Encapsulated Microcircuit (PEM) Derating, Storage and Qualification Report
|
| 165. |
Plastic Encapsulated Microcircuit (PEM) Guidelines for Screening and Qualification for Space
|
| 166. |
Plastic Encapsulated Microcircuits (PEMs) Reliability/Usage Guidelines For Space Applications
|
| 167. |
Processes for Utilizing Laser Machined Metallized Polyimide for Electronic Circuit Applications
|
| 168. |
Qualification of PEMs Using Board-level Testing
|
| 169. |
Qualitative Analysis of MEMS Microphones (slides)
|
| 170. |
Radiation Effects on Electronics 101: Simple Concepts and New Challenges - NEPP WebEx Series #6
|
| 171. |
Reactive Ion Etching Vias in LaRC-SI Polymide Films
|
| 172. |
Recent Photonics Activities Under the NASA Electronic Parts and Packaging (NEPP) Program 2002
|
| 173. |
Recommended PEMs Packaging Test Flow & FIT Numbers used by Candidate Manufacturers 2003
|
| 174. |
Red Plague
|
| 175. |
Reliability Assessment of Embedded Passives for Spaceborne Electronics
|
| 176. |
Reliability considerations for using PEMS in Military Applications
|
| 177. |
Reliability Evaluation of Linear PEMs Rejected During C-SAM Examination (slides)
|
| 178. |
Reliability Implications Of Derating Leading Edge High Complexity Microcircuits
|
| 179. |
Reliability Issues Related to the Fatigue Strength of Gold Wire Used in Electronic Assemblies
|
| 180. |
Reliability of Copper Metallization
|
| 181. |
Reliability of COTS PEMS
|
| 182. |
Reliability of Lead (Pb)-Free Solder Alloy
|
| 183. |
Results for Precision Voltage Reference - PEMS Eval
|
| 184. |
Results of Screening and Qualification Testing of COTS PEMs for Space Applications and Lessons Learn
|
| 185. |
Reworkability of Underfill Materials - 4th Quarter Report
|
| 186. |
S-312-P-003
|
| 187. |
Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies
|
| 188. |
Silicon Carbide Die Attach Scheme for 500°C Operation
|
| 189. |
Snapstrate and Socket for Chip-on-Board Programmable Technologies, September 1998
|
| 190. |
SPICE Modeling the Electrical Interconnect of the Stackable Package
|
| 191. |
Spotlight Optical Cable: NEPP News Flash - January 2002
|
| 192. |
SSB-1: Guidelines for using PEMs.pdf
|
| 193. |
Standard for preparing a COTS assembly management plan.doc
|
| 194. |
Structure Optimization of Au Wire Wedge-bond for High Temperature Applications
|
| 195. |
Structure Optimization of Au Wire Wedge-Bond for High Temperature Applications
|
| 196. |
Study of Measurement Variation in IR Images of COTS Computer Boards
|
| 197. |
Survey of Heterojunction Bipolar Transitor (HBT) Device Reliability
|
| 198. |
Survey of Rework Methods/Equipment and Contract Manufacturers for Various Packaging Technologies
|
| 199. |
Task Plan - 04-003 Lead-Free Characterization Auburn
|
| 200. |
Task Plan - 04-006 Package Level Testing – Alternate Approaches
|
| 201. |
Task Plan - 04-008 PWB Rework
|
| 202. |
Task Plan - 04-013 Extreme Environments: Cold/Hot Temperature Reliability
|
| 203. |
Task Plan - 04-014 Area Array BOK
|
| 204. |
Task Plan - 04-027 SiC Packaging for Wide Band-Gap Microsystems
|
| 205. |
Task Plan - 04-028 High Temperature Wireless Sensing for Health Monitoring
|
| 206. |
Task Plan - 04-048 Radiation Screening of Modern Packaged ICs (New task in FY04)
|
| 207. |
Task Plan - 04-065 Pure Tin Develop Risk Mitigation Strategy
|
| 208. |
Task Plan - 04-070 Auburn’s Center for FY04 Advanced Vehicle Electronics (CAVE)
|
| 209. |
Task Plan - 0425 Embedded Passives
|
| 210. |
Task Plan - 05-002 Microvia
|
| 211. |
Task Plan - 05-003a Lead-Free Characterization Auburn
|
| 212. |
Task Plan - 05-006A Package Level Testing – Alternate Approaches
|
| 213. |
Task Plan - 05-008A PWB Rework
|
| 214. |
Task Plan - 05-013A Extreme Environments: Cold/Hot Reliability
|
| 215. |
Task Plan - 05-014a Area Array BOK
|
| 216. |
Task Plan - 05-015 Reliability of Embedded Active Assemblies
|
| 217. |
Task Plan - 05-027a SiC Packaging for Wide Band-Gap Microsystems
|
| 218. |
Task Plan - 05-036A
|
| 219. |
Task Plan - 05-037a Evaluation of 3D Multi-Chip Modules
|
| 220. |
Task Plan - 05-070a Auburn’s Center for Advanced Vehicle Electronics (CAVE)
|
| 221. |
Task Plan - 05-075 Ceramic Column Grid Array Reliability
|
| 222. |
Task Plan - 06-015a Reliability of Embedded Active Assemblies
|
| 223. |
Task Plan - 06-075a 1000 Pin Packages, CGA Evaluation
|
| 224. |
Task Plan - 06-292 Lead-Free Solder - Reliability
|
| 225. |
Task Plan - 06-295 Hybrid Devices - Reliability
|
| 226. |
Task Plan - 06-299 Advanced Passives: Hand Soldering Ta Chip Capacitors
|
| 227. |
Task Plan - 07-108 Reliability of Recolumned Area Array Packages
|
| 228. |
Task Plan - 07-109 Reliability of Embedded Active Assemblies
|
| 229. |
Task Plan - 07-110
|
| 230. |
Task Plan - 07-111 Embedded Passives Emulation - NEPP & Crane
|
| 231. |
Task Plan - 07-112 Laser Diode Reliability
|
| 232. |
Task Plan - 07-272 Array Packaging Inspection
|
| 233. |
Task Plan - 08-002-2 Area Array Packaging Solder Joint Inspection Techniques
|
| 234. |
Task Plan - 08-130-2
|
| 235. |
Task Plan - 08-131-2 Realiability of Low Pitch High I/O Area Array Packages
|
| 236. |
Task Plan - 08-132-2 Reliability of Recolumned Area Array Packages
|
| 237. |
Task Plan - 08-133-4 Reliability of Embedded Active Assemblies
|
| 238. |
Task Plan - 08-134-3 Power Mosfet Package Reliability
|
| 239. |
Task Plan - 08-135-2 Embedded Passives Emulation
|
| 240. |
Task Plan - 08-136-5 Laser Diode Reliability
|
| 241. |
Task Plan - a06-293 Area Array Packages - CAVE - Reliability
|
| 242. |
Task Plan - Area Array Packages Identifying and Making Available Body of Knowledge
|
| 243. |
Task Plan - Assessment Tools for Existing Space Grade & COTS Electronics Technologies
|
| 244. |
Task Plan - Auburn’s Center for Advanced Vehicle Electronics (CAVE)
|
| 245. |
Task Plan - Characterization of Optical Fiber Cables for Space Flight
|
| 246. |
Task Plan - Chip on Board Reliability
|
| 247. |
Task Plan - Compact Peripheral Component Interconnect (cPCI) Connectors
|
| 248. |
Task Plan - COTS MEMs Sensors-Accelerometers Quality & Reliability
|
| 249. |
Task Plan - Enhanced Reliability of Microelectronic Circuits Interconnects Using Microwave Radiation
|
| 250. |
Task Plan - Evaluation of Alignment Tolerant Optoelectronic Structures
|
| 251. |
Task Plan - Evaluation of Alignment Tolerant Optoelectronic Structures
|
| 252. |
Task Plan - Evaluation of COTS Power GaAs MMIC on Diamond Substrates
|
| 253. |
Task Plan - Evaluation of Thermo-Mechanical Stability of Plastic Encapsulated COTS Components for Space Applicat
|
| 254. |
Task Plan - Evaluation of Three Dimensional Devices and Technologies
|
| 255. |
Task Plan - High Performance Photonic/Optical Circuitry
|
| 256. |
Task Plan - High Performance Photonic/Optical Circuitry
|
| 257. |
Task Plan - Interconnect Reliability of Cold Electronics
|
| 258. |
Task Plan - LaRC-SI Flexible Multi-layered Electrical Circuitry
|
| 259. |
Task Plan - LaRC-SI Flexible Multi-layered Electrical Circuitry
|
| 260. |
Task Plan - Micro-Opto-Electro-Mechanical Systems (MOEMS) Interconnects
|
| 261. |
Task Plan - Packaging and Reliability Assessment of Electronic Noses
|
| 262. |
Task Plan - Packaging and Reliability Assessment of MEMS Broad Band Light Sources
|
| 263. |
Task Plan - Packaging Evaluation of High Power Diode Laser Arrays
|
| 264. |
Task Plan - Packaging of High Temperature SiC Based Electronics and MEMS Pressure Sensor
|
| 265. |
Task Plan - Processes for Utilizing Laser Machined Metallized Polyimide for Electronic Circuit Apps
|
| 266. |
Task Plan - Reliability Assessment of Embedded Passives for Spaceborne Electronics
|
| 267. |
Task Plan - Reliability Assessment of Microvias for Spaceborne Electronics
|
| 268. |
Task Plan - Reliability of NASA Langley Research Center Macro-Fiber Composite (LaRC-MFC) Actuator Assemblies
|
| 269. |
Task Plan - Reliable Board Level Screening Methods
|
| 270. |
Task Plan - Reworkable Underfill Characterization
|
| 271. |
Task Plan - Robust Manufacturing Processes for CSPs
|
| 272. |
Task Plan - SIAP / SOAC - System-in-a-Package / System-on-a-Chip Assessment Qualification
|
| 273. |
Task Status Report: Hand soldering process of Sn/Ag alloy
|
| 274. |
Technology Readiness Overview: Ball Grid Array and Chip Scale Packaging
|
| 275. |
Technology Readiness Overview: Embedded Actives
|
| 276. |
Technology Readiness Overview: Fiber Laser Components
|
| 277. |
Technology Readiness overview: Pb-Free Solder Alloy Investigation
|
| 278. |
Technology Readiness Overview: SiC High Temperature Microsystems and Packaging
|
| 279. |
Technology Survey of SiC High Temperature Microsystems Packaging
|
| 280. |
Technology Validation of Optical Fiber Cables for Space Flight Environments
|
| 281. |
Temperature Dependant Dielectric Properties of Polycrystalline 96% Al2O3
|
| 282. |
Test Flows for Space PEMs
|
| 283. |
The application of PEMS in space.pdf
|
| 284. |
The Continuing Dangers of Tin Whiskers and Attempts to Control Them with Conformal Coating
|
| 285. |
The High-Speed Potential of Multi-Chip Modules Built with Pico-Substrates
|
| 286. |
The Perry Initiative and the use of PEMS in Military Equipment
|
| 287. |
Thermal and Dynamic Assessment for 3D-Plus MCM-V Module
|
| 288. |
Thermal Cycling Effects On A JPL Flip Chip Printed Circuit Board
|
| 289. |
Thermal Cycling Test Results of CSP and RF Package Assemblies
|
| 290. |
Thermal Cycling/Shock Behavior of CSP Assemblies
|
| 291. |
Thick and Thin Film Materials Based Chip Level Packaging for High Temperatures SiC Sensors and Devic
|
| 292. |
Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors
|
| 293. |
Tin Whiskers: Attributes and Mitigation
|
| 294. |
Tin Whiskers: Revisiting An Old Problem
|
| 295. |
Trip Report EIA G12 Meeting 0104 Phoenix AZ MSampson
|
| 296. |
Twelve Channel Optical Fiber Connector Assembly: From Commercial off the Shelf to Space Flight Use
|
| 297. |
Twelve Channel Optical Fiber Connector Assembly: From COTS to Space Flight Use (slides)
|
| 298. |
US Airforce Position on Tin Useage
|
| 299. |
Use of PEMs in Military Equipment
|
| 300. |
Variables Affecting CSP Reliability
|
| 301. |
Vibration-induced Fatigue Failures in Bonding Wires Used in Stacked Chip Modules
|
| 302. |
Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Part 1
|
| 303. |
Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Part 2
|
| 304. |
Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Part 3
|
| 305. |
Video: Electronic Packaging Technology for SiC based High Temperature Micro-systems - Questions
|
| 306. |
Video: Known Problems with the Use of Pure Tin Coatings - Questions
|
| 307. |
Video: Packaging and Reliability of Electronic Noses for Space Applications - Part 1
|
| 308. |
Video: Packaging and Reliability of Electronic Noses for Space Applications - Part 2
|
| 309. |
Video: Packaging and Reliability of Electronic Noses for Space Applications - Questions
|
| 310. |
Video: Known Problems with the Use of Pure Tin Coatings - Part 1
|
| 311. |
Video: Known Problems with the Use of Pure Tin Coatings - Part 2
|
| 312. |
Virtual Qualification of Electronic Hardware
|
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