Ceramic column grid array (CCGA) modules are an extension of the ceramic ball grid array (CBGA) packages. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnection, and to achieve a significant increase in reliability. This guide provides information on CCGA assembly and rework. Like the CBGA modules, all of the CCGA interconnections cannot be inspected and care must be taken to implement good product and process controls. The card assembly and rework process development was an integral part of the evolution of the package requirements. To view the document, please visit the IBM Website