PACKAGING OF MEMS Packaging issues concerning MEMS devices are numerous and complex. The complexity is due to the fact that many MEMS, especially sensors, must interact with the environment while still having to be protected from it. In addition, MEMS are very application specific (i.e.BIOMEMS, RF MEMS) having to interact with extremely diverse environments. Although MEMS packaging utilizes methods developed from the IC industry, special consideration of the mechanical parts must be adressed, therefore specific testing methodologies must be developed for addressing the reliability of packaged MEMS.
[Getters for Reliable Hermetic Packages][Interconnection and Packaging Issues of Microelectromechanical Systems (MEMS) and COTS MEMS]RF MEMS SWITCHRF MEMS Capacitive Membrane Switches are currently under development at the NASA Goddard Space Flight Center. RF MEMS swtich technology offers significant performance advantages over existing traditional technologies (
PIN Diodes,
FETS) for microwave instrumentation. Although there is a large commercial push to mass produce RF MEMS switches, they are designed for use in the wireless communications range,
f < 6 GHz, in the terrestrial environment. NASA interest lies in the
f > 6 GHz range, with device operation taking place in the harsh evnvironment of space most likely at
cryogenic temperatures (30 Kelvin = -243 º Celsius). The major problem plaguing these devices are
dielectric charging. Currently, there is very little reliabilty data available for these devices.
Our goal is to determine the parameters that effect reliabilty early in the design and development phase by subjecting devices to operational and environmental extremes to identify and mitigate detrimental issues.
RF MEMS Ohmic Switches are currently under development by numerous commercial manufacturers. Ohmic Switches offer the same benefits of capacitive switches with even better high frequency performance. However, failure mechanisms, namely
stiction, lead to shorter lifetimes (fewer switching cycles) than capacitive membrane switches.
Our goal is to evaluate and analyze available COTS switches to determine relevant failure modes and mechanisms.
Work on this project is ongoing.
THERMALLY ACTUATED MICROMACHINED RELAYMicromachined relays combine the benefits of solid-state devices such as low size, low weight, minimal power consumption, and fast time response, with the benefits of conventional electromechanical relays, such as low leakage currents and high radiation hardness. Cronos Integrated Microsystems was the first commercial manufacturer to mass produce these devices in the year 2000. Mass production of these parts allowed for using them as a suitable test vehicle for reliability assessments of thermal actuation and microcontact switching.
Thermally Actuated Microrelays have been tested for quality of performance under various electrical loads and thermal environments and also mechanical integrity by subjecting parts to mechanical shocks.
[Reliability Evaluation of Thermally Actuated Micromachined Relays for Space Applications][Interconnection and Packaging Issues of Microelectromechanical Systems (MEMS) and COTS MEMS]
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