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NASA Workmanship
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The URL for NASA Workmanship is http://workmanship.nasa.gov/index.jsp. The NASA Workmanship Technical Committee (NWTC) serves as the agency's technical authority to ensure that adequate workmanship standards and training for electronic hardware are available to NASA, its suppliers, and the aerospace community. The NWTC is responsible for documenting wo manship requirements and design criteria for the manufacture of space flight, aeronautics, and mission critical ground support electronic hardware.

The committee evaluates the adequacy of Voluntary Consensus Standards (VCS's) per A-119 and provides advocacy when appropriate. When no industry standard adequately addresses the workmanship needs for NASA, the NWTC partners with VCS organizations to generate an industry standard, or they generate and maintain NASA Standards and Training material. As a technical resource to the agency, the NWTC may be called upon to generate manufacturing best practice guidance to assist NASA programs manage risk and ensure safety and mission success.

To access the workmanship lessons learned photos click on the links below:

 

Components

1. Buswire fracture due to nick in lead

2. C2 MOS capacitor ESD damage

3. Capacitor electrolyte leakage

4. Conformal coating under diode

5. Excess solder wicking up into sockets

6. Improper lead forming resulting in part damage

7. Lead damaged due to incorrect bending tool-process

8. Lead fracture do to inadequate mechanical support

Wiring and Cabling

1. Birdcaging of wires contributing to failures

2. Brittle gold plating on contacts

3. Contact damage due to improper mating

4. RF Coaxial Cable damage due to improper handling

5. Shield damage on connector

6. Solder sleeves nickel plated stranded copper wire

7. Wire distortion due to excessive tiewrap tension

8. Wire shorting problem

Printed Wiring Assemblies (PWAs)

1. Bubbles in conformal coating under FPGA

2. Chlorine contamination

3. Conformal coating non-wetting

4. Excessive staking

5. Fatigue fracture - no mechanical support

6. Fiber contamination in conformal coating.

7. Improper modification of solder lug causing short

8. Improper use of removal tool

9. Insufficient/wrong type of staking material

10. Lack of staking material causing lead breakage

11. Lack of stress relief

12. Possible shorting potential resulting from contamination

13. Solder cup cold solder joint failure

14. Staking compound negating stress relief

15. Staking failure on tantalum capacitor

16. Wavesolder process problem

 

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      Last Updated: January 25, 2006