NEPP - Semiconductor Devices

Background

MIL-PRF-19500, the General Specification for Semiconductor Devices, establishes the general performance requirements for semiconductor devices. Detail requirements and characteristics are specified in the performance specification (Slash) sheet. Revisions to this and performance specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection (CI) completion date. Five quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, JANJ, and JANS. Seven radiation hardness assurance (RHA) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

Major Issues

There are numerous manufacturers listed in the current QML, QML-19500-18, but the List is dominated by one manufacturer. This can potentially cause problems with delivery schedules and competitive costing.

Manufacturers not listed on the QML may offer space flight level parts. If they offer an in-house "space level" processing flow, compare it to the MIL-PRF-19500 specification screening, qualification requirements to assure that you are getting adequate quality assurance that is needed to meet your mission requirements.

If you have a radiation requirement, total ionizing dose (TID) as well as single event upset (SEU), make sure that the parts come from lots tested for radiation levels that are expected for the mission.

Documents and References