| |
Project Publications |
| 1. |
0607 Xilinx/NASA: Meeting Schedule
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| 2. |
0607 Xilinx/NASA: Activities Associated with Working with Xilinx to Develop a Space Flow for Virtex
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| 3. |
0607 Xilinx/NASA: Aerospace Status Review (slides)
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| 4. |
0607 Xilinx/NASA: Assembly Reliability for Two CCGA Packages (slides)
|
| 5. |
0607 Xilinx/NASA: Attendance List for GFSC June 26, 2006 Meeting
|
| 6. |
0607 Xilinx/NASA: Design for Performance Optimization of Virtex Devices (slides)
|
| 7. |
0607 Xilinx/NASA: FPGA Mission Assurance Center (slides)
|
| 8. |
0607 Xilinx/NASA: The NASA Electronic Parts and Packaging (NEPP) Program (slides)
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| 9. |
0607 Xilinx/NASA: Xilinx Space Heritage (slides)
|
| 10. |
0607 Xilinx/NASA: Xilinx V4 Single Event Effects (SEE) High-Speed Testing (slides)
|
| 11. |
0607 Xilinx/NASA: Defense and Aerospace Screening Flows (slides)
|
| 12. |
0607 Xilinx/NASA: Multi-Bit Upsets in the Virtex Devices (slides)
|
| 13. |
0607 Xilinx/NASA: Reconfigurable Scalable Computing for Space Applications (slides)
|
| 14. |
0607 Xilinx/NASA: Reliability Engineering – An Integrated Approach at Xilinx (slides)
|
| 15. |
0607 Xilinx/NASA: SpaceCube IRAD Development Effort (slides)
|
| 16. |
3D MEMs in Standard Processes: Fabrication, Quality Assurance, and Novel Measurement Microstructures
|
| 17. |
3rd NEPP Workshop Program Guide
|
| 18. |
A Comparison Of Moisture Resistance With Different Types Of End-Terminations In Ceramic Capacitors
|
| 19. |
A General Approach to MEMS Reliability Assurance
|
| 20. |
A Model for Comprehensive Studies of Porosity in Mesoporous Low-K Dielectrics
|
| 21. |
A Rapid Technique for Moisture Diffusion Characterization of Molding Compounds in PEMs
|
| 22. |
A Technique for Assessing the Moisture Resistance of PEMs Using MOS Test Structures
|
| 23. |
Acoustic Microscopy, a Tool for Evaluating Quality of Microelectronics
|
| 24. |
Adatom Condenstation and Quantum Dot Sizes in InGaAs/GaAs (001)
|
| 25. |
AFMC COTS Guide - 1993
|
| 26. |
AFRL/AFMC Military Products from Commercial Lines (TRW 1999)
|
| 27. |
Alternative Test Methods for Electronic Parts
|
| 28. |
Analysis of Failure Modes in Therm Actuated MEMS Relays
|
| 29. |
Analysis of Plastic Parts Package Delamination
|
| 30. |
Analytical Laboratory Equipment: Meeting Notes from Sematech Analytical Lab Manager's Council, 2001
|
| 31. |
Applications for Fiber Amplifiers For Space: Laser Altimetry and Mapping
|
| 32. |
ASAP Vendor Information Matrix (VIM)
|
| 33. |
Assembly Reliability of Ball Grid Array and Chip Scale Packages for High Reliability Applications
|
| 34. |
ATC Capacitor RF Evaluation Device #9 - Graph
|
| 35. |
ATC Capacitor RF Evaluation Device #9 - Test 1
|
| 36. |
ATC Capacitor RF Evaluation Device #9 - Test 10
|
| 37. |
ATC Capacitor RF Evaluation Device #9 - Test 2
|
| 38. |
ATC Capacitor RF Evaluation Device #9 - Test 3
|
| 39. |
BOK Guideline Document on Commercial MNOS EEPROM in Space Applications
|
| 40. |
Building Reliability into ASIC Design
|
| 41. |
Capacitor Military Specification Coordination Meeting (DSCC)
|
| 42. |
CAVE - Overview of Lead Free Solder Research
|
| 43. |
Challenges with PEMS Found in the MMEM Study - Rockwell Study (slides)
|
| 44. |
Characteristic Times of Moisture Diffusion and Bake-out Conditions for Plastic Encapsulated Parts
|
| 45. |
Characterization of a Twelve Channel Optical Fiber, Ribbon Cable and MTP Array Connector Assembly...
|
| 46. |
Characterization of Philips UBA2033 SoI Full-Bridge Driver
|
| 47. |
Characterization of Tantalum Polymer Capacitors
|
| 48. |
Characterization of Tantalum Polymer Capacitors
|
| 49. |
Characterizing Space Flight Inductors and Transformer Failures
|
| 50. |
Chlorine contamination diffusion in silicones
|
| 51. |
Choosing the Right Lead-Free Solder
|
| 52. |
Commercial off the shelf for LHS experiments.pdf (slides)
|
| 53. |
Commercial Tree of HBTs
|
| 54. |
Comparison of Radiation Hard and Radiation Tolerance FPGAs for Space Applications - 2004
|
| 55. |
Compound Semiconductor Reliability
|
| 56. |
Concerns About Commercial Component Obsolecense in Commercial Aircraft 1998 (slides)
|
| 57. |
Conference Agenda: Reliability, Testing, and Characterization of MEMS/MOEMS II
|
| 58. |
Controlled PEMs A High Density Packaging Solution for Space.pdf
|
| 59. |
Corrosion of Silver-Plated Copper Conductors
|
| 60. |
Cost Impacts of Upgrading Electronic Parts for Use in NASA Space Flight Systems
|
| 61. |
COTS and ROTS for mission critical systems.pdf
|
| 62. |
COTS Ceramic Chip Capacitors: an Evaluation of the Parts and Assurance Methodologies (paper)
|
| 63. |
COTS Ceramic Chip Capacitors: an Evaluation of the Parts and Assurance Methodologies (slides)
|
| 64. |
COTS PEMs Procurement/Acquisition Concerns and Issues
|
| 65. |
COTS/MEMS Accelerometers Test Plan
|
| 66. |
Cryogenic Evaluation of an Advanced DC/DC Converter Module For Deep Space Applications
|
| 67. |
Current Silicon Die Thinning and Bonding onto Membranes Technologies for Solar Sails - An Abstract
|
| 68. |
Current Silicon Die Thinning and Bonding onto Membranes Technologies for Solar Sails - Presentation
|
| 69. |
Cyclic Voltametric Response of Boron-Doped CVD Diamond
|
| 70. |
Data Reports - Device Testing in Cryogenic Temperatures NEPP04 Deliverable
|
| 71. |
Degradation of Surface Mount Solid Tantalum Capacitors in Humid Environments
|
| 72. |
Design of Test Platform for Burn-in of SRAM-based FPGAs
|
| 73. |
Development And Application Of High Temperature Sensors And Electronics
|
| 74. |
Different Modes of Surface Passivation of GaAs
|
| 75. |
Does Red Phosphorus in Molding Compounds for Electronic Devices Present a Reliability Risk?
|
| 76. |
DPA Guide for PEMs - Draft
|
| 77. |
Dynamic Stress Analysis of TSOP Devices with Different Chip Sizes
|
| 78. |
EEE Links January 2003
|
| 79. |
EEE Links Volume 10 No. 2 Apr. 2004
|
| 80. |
EEE Parts Management and Control For MSFC Space Flight Hardware
|
| 81. |
EEE-INST-002: Instructions for EEE Parts Selection, Screening, Qualification, and Derating
|
| 82. |
Effect of Environments on Degradation of Molding Compound and Wire Bonds in PEMs
|
| 83. |
Effect of Extreme Temperature Cycling of PDIP-8 OP181 Op Amp
|
| 84. |
Effect of Inductance and Requirements for Surge Current Testing of Tantalum Capacitors
|
| 85. |
Effect of Moisture on Characteristics of Surface Mount Solid Tantalum Capacitors
|
| 86. |
Effect of Surge Current Testing on Reliability of Solid Tantalum Capacitors
|
| 87. |
Effect of Vacuum on High Temperature Degredation of Gold/Aluminum Wire Bonds in PEMs
|
| 88. |
Effect of Vacuum on High-Temperature Degradation of Au-Al Wire Bonds in PEMS
|
| 89. |
Effects of Cryogenic Temperatures and Thermal Cycling on Characteristics of New SiGe HJBT's
|
| 90. |
Effects of Extreme Temperature on JFET and CMOS Op-Amps
|
| 91. |
Effects of humidity on non-hermetically packaged III-V structures and devices
|
| 92. |
Effects of humidity on non-hermetically packaged III-V structures and devices (poster)
|
| 93. |
Effects of Ionizing Radiation on the Mechanical and Electrical Properties of Carbon Nanotubes
|
| 94. |
Effects of Low Temperature and Thermal Cycling on Switching Characteristics of 2N3811 PNP and LM394
|
| 95. |
Effects of non-hermeticity in space-relevant III-V devices
|
| 96. |
Effects of Via-Conductor Orientation in the Electromigration Failure of Al-Cu Wires
|
| 97. |
EFlash DC-to-DC Converters 01QTR04
|
| 98. |
EIA G-11 (Passive Parts Committee) Meeting Notes February 1998
|
| 99. |
EIA G-11 (Passive Parts Committee) Meeting Notes June 1997
|
| 100. |
EIA G12 Meeting January 13-14, 2004, Phoenix, Arizona
|
| 101. |
Electromigration Failure in Au and Joule Heating Induced Oxidation in Cu Conductors
|
| 102. |
Electromigration Failure in Au and Joule Heating Induced Oxidation in Cu Conductors - Part 1
|
| 103. |
Electromigration Failure in Au and Joule Heating Induced Oxidation in Cu Conductors - Part 2
|
| 104. |
Electromigration Failure in Au and Joule Heating Induced Oxidation in Cu Conductors - Part 3
|
| 105. |
Electronic Components for the Commercialization of Space Systems Workshop
|
| 106. |
Enabling COTS Parts Insertion in NASA Systems: A Combined NEPAG (Q, AE) – NEPP Program (AE) Activity
|
| 107. |
Environmental Conditions for Space Hardware: A Survey
|
| 108. |
Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: Presentation
|
| 109. |
Environmental Hysteresis in Moulding Compounds and Volt Reference PEMs: White Paper
|
| 110. |
Environmental Stress Testing of Power Transistors Encapsulated in Plastic Packages
|
| 111. |
Environmentally Induced Swelling and Shrinkage of Molding Compounds in PEMs
|
| 112. |
EOS Simulation and Failure Analysis of Metallurgically Bonded Silicon Diodes.
|
| 113. |
ESD Prevention for GSFC Hardware
|
| 114. |
ESEM/AFM analysis report
|
| 115. |
EV61261_LT1014IS
|
| 116. |
EV72015_LT1014IS
|
| 117. |
EV78074_58V1001T25
|
| 118. |
Evaluation of RF MEMS Lifetime Performance in a High Power (>1W) Application
|
| 119. |
Evaluation of 1N4148 Small Signal Diodes and 1N5819 Schottky Rectifiers Under Extreme Temperatures
|
| 120. |
Evaluation of 3D Plus Test Structures
|
| 121. |
Evaluation of Data Retention Characteristics for Ferroelectric Random Access Memories (FRAMs)
|
| 122. |
Evaluation Of Linear Technology LT1461 Voltage Reference At Low Temperatures
|
| 123. |
Evaluation of Maxwell Technology PowerCache Ultracapacitor
|
| 124. |
Evaluation of Micromachined Relays for Space Applications
|
| 125. |
Evaluation of MultiLayer Ceramic Capacitors for Low Voltage Type Failures - October 20, 2000
|
| 126. |
Evaluation of Thermo-Mechanical Stability of COTs Dual Axis MEMS Accelerometers for Space Apps
|
| 127. |
Evaluation of Voltage Reference Circuits and N-Channel Field Effect Transistors at Low Temperatures
|
| 128. |
Evaluation Report for the Amphenol-Bendix 453 Miniature Circular Connector with Mil-T-29504 Optical
|
| 129. |
Experience With Plastic Part Evaluations at Cold Temperatures
|
| 130. |
Experiment Test Plan for Determining Low Voltage Failure Mechanism in Ceramic Capacitors
|
| 131. |
Extreme Temperature (-125oC to +90oC) Thermal Cycling of UC282, LT1813, and LTC1409
|
| 132. |
Fabricating Diamond Membranes Using Reactive-Ion Etching
|
| 133. |
Failures in Hybrid Microcircuits during Environmental Testing
|
| 134. |
FEA on a Failed Internal Wire in a DC/DC Converter
|
| 135. |
Fiscal Year 2002 NEPP Tasks
|
| 136. |
Giant Magnetoresistive (GMR) Sensor MicroElectroMechanical System (MEMS) Device
|
| 137. |
Glass Transition Temperature (Tg) Paper JPL
|
| 138. |
Glass Transition Temperature (Tg) Presentation JPL
|
| 139. |
GLAST LAT Project Parts and Mission Assurance Requirements (slides)
|
| 140. |
Growth evolution, adatom condensation, and island sizes in InGaAs/GaAs (001): Poster
|
| 141. |
GSFC Parts Engineering in COTS PEMs era (slides)
|
| 142. |
Guide of Space Grade Requirements for Electrical Connectors
|
| 143. |
Guidebook on the Use of PEMs at High Altitudes (slides)
|
| 144. |
Heavy Ion SEE Test Report for 4A Adjustable Switching Regulator MSK5042 Run 1 of 2
|
| 145. |
High Frequency Of Radiation Hardened CMOS 8-Bit Flash Analog-To-Digital Converter At Cryogenic Temp.
|
| 146. |
High Power Laser Diode Array Qualification and Guidelines for Space Flight Environments
|
| 147. |
High-Temperature Degradation of Wire Bonds in Plastic Encapsulated Microcircuits
|
| 148. |
Historical: Draft Specification for Optical Cable for Space Flight III
|
| 149. |
Hot-Carrier Degradation of 2-Volt Silicon-On-Insulator (SOI) Transistors
|
| 150. |
Hot-Carrier Reliability of Transistors Fabricated by 0.25-mm Fully-Depleted SOI CMOS (Abstract)
|
| 151. |
Hybrid DC to DC Hybrid Power Converter Issues: Overview Needs vs Supply Chain
|
| 152. |
Hybrid Supplier Assessment Checklist
|
| 153. |
Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (paper)
|
| 154. |
Impact of Tg of Molding Compounds on Screening and Reliability Qual of PEMs for Space (slides)
|
| 155. |
In-flight Annealing of Displacement Damage in GaAs LEDs: A Galileo Story
|
| 156. |
In-situ Measurements of Thermo-Mechanical Characteristics of Molding Compounds in PEMs
|
| 157. |
Interconnection and Packaging Issues of Microelectromechanical Systems (MEMS) and COTS MEMS
|
| 158. |
International Rectifier Radiation-Hardened Power MOSFETs Under Wide Temperature
|
| 159. |
Intersil HS-9008RH CMOS 8-Bit Flash Analog To Digital Converter in Temp. Range Of 23 C To 193 C
|
| 160. |
INTRODUCING A NEW MEMBER TO THE FAMILY: GOLD WHISKERS
|
| 161. |
Investigation of Stepper Motor Controllers For Ultra Low Temperature Environments
|
| 162. |
ISS FIber Optic Failure Investigation Root Cause Report
|
| 163. |
Issues Concerning the Replacement of Lead in Hi-Rel Electronic Applications
|
| 164. |
JPL Institutional Parts Program Requirements
|
| 165. |
JPL's Guide to Plastic COTS Parts (slides)
|
| 166. |
Laser Diode Initiated Systems for Space Applications
|
| 167. |
LCC20 PACKAGES ON T.I. LM158A OPERATIONAL AMPLIFIERS UNDER EXTREME TEMP. & WIDE THERMAL CYCLING
|
| 168. |
Lead-Free Soldering for Space Applications TRO/BKO (Appdx's Only)
|
| 169. |
Lead-Free Soldering for Space Applications TRO/BKO (w/o Appdx's)
|
| 170. |
LEMO 3-Pin Connector Thermal Test in Vacuum
|
| 171. |
Lessons Learned from Screening and Qualification of COTS PEMs for Space Applications (slides)
|
| 172. |
Lessons Learned from Screening and Qualification Testing of COTS PEMS in 2004
|
| 173. |
Level I , II and III Requirements Compared for Microcircuits
|
| 174. |
Low Temperature Evaluation of HTANFET SOI N-CHANNEL FET
|
| 175. |
Low Temperature Evaluation Of The LTC1419 A/D Converter
|
| 176. |
Low Temperature Evaluation Of The LTC1799 Oscillator
|
| 177. |
Low Temperature Evaluation of the TC170 CMOS Current-Mode PWM Controller
|
| 178. |
Low Temperature Evaluation of the UCC1802 Low Power BiCMOS Current Mode PWM
|
| 179. |
Low Temperature Evaluation of the UCC3581 Voltage-Mode PWM Controller
|
| 180. |
Low Temperature Evaluation of the UCC3585 Low Voltage Synchronization Buck Controller
|
| 181. |
Low Temperature Evaluation of the UCC3588 5-bit Programmable Output Power Supply Controller
|
| 182. |
Low Temperature Evaluation of the Unitrode UC3846 Current-Mode PWM Controller
|
| 183. |
Low Temperature Performance of a 12-bit Serial CMOS A/D Converter
|
| 184. |
Low Temperature Testing of JPL BGA Board #1
|
| 185. |
Low-Cost Low Actuation Voltage Copper RF MEMS Switches
|
| 186. |
Low-Temperature Electronics for Space & Terrestrial Applications - NEPP Webex Series #2
|
| 187. |
Meeting Minutes G-11 September 2003
|
| 188. |
Meeting Report: DSCC, Resistors, 1996
|
| 189. |
MEMS Microphone_NEPP_Final Report
|
| 190. |
MEMS Reliability Alliance Technical Report No. 36-01 Dimpled Hinge Design and Analysis
|
| 191. |
MEMS Reliability Alliance Technical Report No. 36-02 Minimum Dimension Dimple Analysis - 7/14/00
|
| 192. |
MEMS Reliability Alliance Technical Report No. 37-01 Unrelased Polysilicon Beam Failure - 8/4/00
|
| 193. |
MEMS Sensors and Carrier-Level Reliability
|
| 194. |
Micro Nano Technology Visualization (MNTV) of Micromachined MEMS Polysilicon Structures
|
| 195. |
Micromachined Low-Loss Microwave Switches
|
| 196. |
Micromechanical Membrane Switches
|
| 197. |
Microstructural Evolution near the InGaAs/GaAs Stranski-Krastanow Transformation (Poster)
|
| 198. |
MIL-PRF-39003 - Capacitors, Fixed, Electrolytic (Solid Electrolyte), Tantalum
|
| 199. |
MIL-PRF-39015/3L, Resistors, Variable, Wire-Wound (Lead-Screw Actuated),Est. & NonEst. Reliability,
|
| 200. |
MIL-PRF-55365 - Capacitor, Fixed, Electrolytic (Tantalum), Chip, Est. & Non-Est Reliability
|
| 201. |
MIL-R-39016/29F - Relays, Electromagnetic, Established Reliability
|
| 202. |
MIL-STD-1553 AIRCRAFT INTERNAL TIME DIVISION COMMAND/RESPONSE MULTIPLEX DATA BUS
|
| 203. |
Moisture Characteristics of Molding Compound and Environmental Effects in PEMs (slides)
|
| 204. |
Moisture Characteristics of Molding Compounds in PEMs (slides)
|
| 205. |
Moisture diffusion in molding compounds and quality assurance of PEMs for space applications
|
| 206. |
Moisture effects in PEMs intended for space applications (slides)
|
| 207. |
Motorola MMA1201P Accelerometer Test Plan and Preliminary Test Results
|
| 208. |
Multi Spectral Lidar
|
| 209. |
NASA Electronics Parts & Packaging Program Assurance Research on Optoelectronics
|
| 210. |
NASA/JPL A/D Converter Selection Guide
|
| 211. |
NEPAG PEMS Activation Energy Calculator
|
| 212. |
NEPAG PEMS CSAM Data Analysis for Multiplexer
|
| 213. |
NEPAG PEMS CSAM Data Review for Multiplexer
|
| 214. |
NEPAG PEMS Guidelines DRAFT
|
| 215. |
NEPAG PEMS MSL & Moisture Qualification Results
|
| 216. |
NEPAG PEMS Packaging Evaluation Results
|
| 217. |
NEPP Conference 2002 Final Program
|
| 218. |
NEPP News Flash - June 2001
|
| 219. |
NEPP News Flash - November 2001
|
| 220. |
NEPP News Flash - October 2002
|
| 221. |
NEPP News Flash - September 2001
|
| 222. |
NEPP Parts Activities Presented to SPWG (March 1998)
|
| 223. |
Notes on the Reliability of The HST Gyros
|
| 224. |
On the Suitability of Fiber Optic Data Links in the Space Radiation Environment
|
| 225. |
Operation of SiGe VCO's at Cryogenic Temperatures
|
| 226. |
Optical Assemblies for Space Environments: Characterization of W.L.Gore Flexlite with Diamond AVIMS
|
| 227. |
Overview of COTS Reliability Work Done by JPL
|
| 228. |
Overview of NEPAG COTS PEMS Evaluation
|
| 229. |
Package induced instability in voltage reference PEMs (slides)
|
| 230. |
Package Qualification Testing Results Performed on the 5 Part Types in the NEPP/NEPAG PEMS Study
|
| 231. |
Packaging of High Temperature SiC Based Electronics
|
| 232. |
Parts Obsolescence Workshop: Impact of Commercial Parts on Part Obsolescence 1997
|
| 233. |
Pb Free Solder Report Draft R3-71305
|
| 234. |
PEM-INST-001 Instructions for Plastic Encapsulated Microcircuit (PEM) Select, Screen, & Qualify
|
| 235. |
PEMS Cold Tests Powerpoint Slides
|
| 236. |
PEMS CSAM Presentation JPL
|
| 237. |
PEMs Research
|
| 238. |
PEMS-INST-001 (pointer)
|
| 239. |
Performance of AD8065 SOI Op Amp Under Wide Temp Cycling
|
| 240. |
Performance of Analog Devices OP284 OpAmps Under Wide Temperature Cycling
|
| 241. |
Performance of Precision Floating Gate Analog Voltage References at Cryogenic Temperatures
|
| 242. |
Performance of Rad-Hard Quad Receivers at Extreme Temperatures
|
| 243. |
Performance of SiGe Power Transistors (Type E12F0001AM) at Elevated Temps
|
| 244. |
Performance Of The AD590 Temperature Transducer At Low Temperature
|
| 245. |
Performance Of The Analog Devices AD780BR Voltage Reference At Cryogenic Temperatures
|
| 246. |
Performance of the LTC1650 16-bit D/A Converter at Cyrogenic Temperatures
|
| 247. |
Performance of Various Types of Diodes at Cryogenic Temperatures
|
| 248. |
Performance of Various Types of Resistors at Low Temperatures
|
| 249. |
Performance of Vishay Siliconix U430 JFET Transistor at Extreme Temperatures
|
| 250. |
Phase And Gain Response Of A Closed-Loop-Control High Voltage DC-DC Converter At Cryo Temperatures
|
| 251. |
Plastic Encapsulated Microcircuit (PEM) Derating, Storage and Qualification Report
|
| 252. |
Plastic Encapsulated Microcircuit (PEM) Guidelines for Screening and Qualification for Space
|
| 253. |
Plastic Encapsulated Microcircuits (PEMs) Reliability/Usage Guidelines For Space Applications
|
| 254. |
Pointer for task deliverable for "Qualification methodology and design rule generation"
|
| 255. |
Potential Manufacturers for High Reliability Solid-State Relays
|
| 256. |
Preliminary Evaluation of Data Retention Characteristics for Ferroelectric Random Access Memories
|
| 257. |
Preliminary reliability evaluation of commercially available low-k interlayer dielectrics for space
|
| 258. |
Preliminary Reliability Evaluation of Copper-Interconnect Metallization Technology
|
| 259. |
Preliminary Test Plan for Evaluating the Reliability of Cu-Based Metallization Systems
|
| 260. |
Preliminary Test Plan for Reliability Evaluation of Copper-Based Metallization Systems
|
| 261. |
Probability of Success of Interpoint MTR28xxd Converters Used in Image
|
| 262. |
Programmable Oscillators: Evaluation Test Report
|
| 263. |
Programmable Read Only Memory (PROM) Programming Procedure Guideline, 2000
|
| 264. |
Prototype SiGe Power Diodes at Extreme Temperatures
|
| 265. |
Qualification of PEMs Using Board-level Testing
|
| 266. |
QUALIFIED PARTS LIST DIRECTORY
|
| 267. |
Qualified Parts List Directory
|
| 268. |
Qualitative Analysis of MEMS Microphones (slides)
|
| 269. |
Radiation Effects on Electronics 101: Simple Concepts and New Challenges - NEPP WebEx Series #6
|
| 270. |
Recommended PEMs Packaging Test Flow & FIT Numbers used by Candidate Manufacturers 2003
|
| 271. |
Red Plague
|
| 272. |
Red Plague - Quick Links
|
| 273. |
Relay Failures Specific to Space Applications
|
| 274. |
Reliability Analysis of Avionics in the Commercial Aerospace Industry
|
| 275. |
Reliability Assessment of Advanced Flip Chip in Cryogenic Temperatures
|
| 276. |
Reliability Assessment of the Integrity of Aluminum Interconnect for a FDSOI Process using FEA
|
| 277. |
Reliability Characterization of GaAs FET Test Structures for Applications in RF/Microwave Modules
|
| 278. |
Reliability considerations for using PEMS in Military Applications
|
| 279. |
Reliability Evaluation of FDSOI Technology for Space Applications - Part 1
|
| 280. |
Reliability Evaluation of FDSOI Technology for Space Applications - Part II
|
| 281. |
Reliability Evaluation of Linear PEMs Rejected During C-SAM Examination (slides)
|
| 282. |
Reliability Evaluation of MIT/LL FDSOI 0.25 mm Process for Space Applications
|
| 283. |
Reliability Evaluation of Thermally Actuated Micromachined Relays for Space Applications
|
| 284. |
Reliability Implications Of Derating Leading Edge High Complexity Microcircuits
|
| 285. |
Reliability Issues of COTS MEMS for Aerospace Applications
|
| 286. |
Reliability of Bvgdo Degraded Power X-Band GaAs MESFET
|
| 287. |
Reliability of COTS PEMS
|
| 288. |
Reliability of Electronics at Cryogenic Temperatures
|
| 289. |
Reliability of NMOS Transistors from LL FDSOI Processes
|
| 290. |
Response of a FM08 Style Fuse to a Pulse of Current: Memo to XTE Project
|
| 291. |
Results for Precision Voltage Reference - PEMS Eval
|
| 292. |
Reverse Bias Behavior of Surface Mount Solid Tantalum Capacitors
|
| 293. |
Reverse-Bias Degradation of SiGe Transistors at Normal and Cryogenic Temperatures
|
| 294. |
Reverse-Bias Degradation of SiGe Transistors at Normal and Cryogenic Temperatures - Ext'd Abstract
|
| 295. |
RF MEMS Benefits and Challenges of an Evolving Switch Technology
|
| 296. |
RF Power handling of Capacitive RF MEMS Devices
|
| 297. |
S-311-641B, Switches, Thermostatic, General Requirements For
|
| 298. |
S-311-P-718/1 CONNECTORS, ELECTRICAL, RECTANGULAR, POLARIZED SHELL FOR SPACE FLIGHT USE
|
| 299. |
SAE-AS81703 Connectors, Electric, Circular, Miniature, Rack & Panel or Push-Pull Coupling
|
| 300. |
Selected Literature on COTS products.pdf
|
| 301. |
Sensor Technology TRO: Near Infrared Avalanche Photodiodes
|
| 302. |
SEUs in Evolving Commercial Silicon-on-Insulator Microprocessor Technologies
|
| 303. |
SiC and SOI Electronics for Harsh Environmental Applications - Part 1
|
| 304. |
SiC and SOI Electronics for Harsh Environmental Applications - Part 2
|
| 305. |
SiC and SOI Electronics for Harsh Environmental Applications - Part 3
|
| 306. |
SiC and SOI Electronics for Harsh Environmental Applications - Part 4
|
| 307. |
Solder Reflow Failures in Electronic Components during Manual Soldering
|
| 308. |
Solid Tantalum Capacitor Surge Current Failure Mechanism Experiment
|
| 309. |
Space Flight Heritage of Optical Fiber Cables
|
| 310. |
Space Parts Working Group (SPWG) Trip Report March 1998
|
| 311. |
Space Qualification of InGaAs/InP Active Pixel Receivers
|
| 312. |
Spotlight FPGA's: NEPP News Flash - December 2002
|
| 313. |
SSB-1: Guidelines for using PEMs.pdf
|
| 314. |
Standard for preparing a COTS assembly management plan.doc
|
| 315. |
Structure Optimization of Au Wire Wedge-bond for High Temperature Applications
|
| 316. |
Surface Micromachining of Diamond for Fabrication of MEMS Microstructures
|
| 317. |
Surface Properties Of Micromachined Polycrystalline Silicon Structures - August 2000
|
| 318. |
Survey of Heterojunction Bipolar Transitor (HBT) Device Reliability
|
| 319. |
Switching Characteristics of JFET Transistors
|
| 320. |
Task Plan - 04-007 Board Level Bare PWB and board level
|
| 321. |
Task Plan - 04-051 Fiber Optic Link Radiation Qualification Guide
|
| 322. |
Task Plan - 04-054 FPGA Radiation Testing (Continuation from FY03)
|
| 323. |
Task Plan - 04-058 Radiation Survey of Widebandgap Microelectronics (New in FY04)
|
| 324. |
Task Plan - 04-059 Radiation Effects Qualification of ADCs
|
| 325. |
Task Plan - 04-001 COTS Guidelines
|
| 326. |
Task Plan - 04-002 Parts Data Management Approaches
|
| 327. |
Task Plan - 04-004 Lead-free Solder Survey Body of Knowledge
|
| 328. |
Task Plan - 04-005 Alternate Approaches for Component Level Testing
|
| 329. |
Task Plan - 04-009 NDE, NDI: BOK and NASA Equipment Survey
|
| 330. |
Task Plan - 04-010 Avionics Architectures: BOK
|
| 331. |
Task Plan - 04-011 EEE Obsolescence (ISS, SSP, OSP) New for FY04
|
| 332. |
Task Plan - 04-012 Reliability Analysis - EEE Parts Tools
|
| 333. |
Task Plan - 04-015 MEMs/MOEMs BOK, Insertion opportunities, and intra-agency coordination
|
| 334. |
Task Plan - 04-016 COTS PEMS Guide and Testing
|
| 335. |
Task Plan - 04-017 COTS/PEMs:BOK on COTS Insertion Experience Inter-Agency Information Exchange
|
| 336. |
Task Plan - 04-018 Burn-In for FPGAs/ASICs – BOK, Testability
|
| 337. |
Task Plan - 04-019 FPGA BOK
|
| 338. |
Task Plan - 04-020 ASIC Technology BOK
|
| 339. |
Task Plan - 04-021 Programmable Oscillators
|
| 340. |
Task Plan - 04-022 Advanced Processors Technology Assessment
|
| 341. |
Task Plan - 04-023 Microcontrollers and Digital Signal Processor Survey
|
| 342. |
Task Plan - 04-024 Analog-to-Digital Converters - BOK
|
| 343. |
Task Plan - 04-025 COTS DRAMs - BOK
|
| 344. |
Task Plan - 04-026 Mixed Signal Devices for Low/High Temperature
|
| 345. |
Task Plan - 04-029 Rad Hard Testing of Mobile Routing Technology
|
| 346. |
Task Plan - 04-030 MEMS & Electret Microphone Technology Assessment
|
| 347. |
Task Plan - 04-031 FY04 Wireless Sensors
|
| 348. |
Task Plan - 04-032 Laser Diode Reliability: BOK
|
| 349. |
Task Plan - 04-033 Traditional Parts Coordination
|
| 350. |
Task Plan - 04-034 Embedded Actives
|
| 351. |
Task Plan - 04-035 Guidance For 0201 Passive Technologies
|
| 352. |
Task Plan - 04-036 Embedded Passives
|
| 353. |
Task Plan - 04-037 Evaluation of 3D Multi-Chip Modules
|
| 354. |
Task Plan - 04-038 Solid State Relay New for FY04
|
| 355. |
Task Plan - 04-039 Wiring Integrity
|
| 356. |
Task Plan - 04-040 Photonics Survey - BOK
|
| 357. |
Task Plan - 04-041JPL NEPP/NEPAG Task Management, Coordination & Tracking
|
| 358. |
Task Plan - 04-044 Analog Single Event Transients – ASET
|
| 359. |
Task Plan - 04-045 Digital Single Event Transients (DSETs)
|
| 360. |
Task Plan - 04-049 Radiation Effects on SiGe Microelectronics
|
| 361. |
Task Plan - 04-052 Digital and Mixed Signal ASIC Foundry Radiation Assessments (New task in FY04)
|
| 362. |
Task Plan - 04-053 Sensor Technologies Radiation Effects Continuation from FY03)
|
| 363. |
Task Plan - 04-055 Technology Programs Collaboration - Radiation (New task in FY04)
|
| 364. |
Task Plan - 04-056 Institute for Space and Defense Electronics (ISDE – Vanderbilt University)
|
| 365. |
Task Plan - 04-057 Hardened by Design Microelectronics Comparison and Test Methods
|
| 366. |
Task Plan - 04-060 Radiation Effects and Transformational Communications
|
| 367. |
Task Plan - 04-061 Statistical Sample Size for Radiation Effects Qualification
|
| 368. |
Task Plan - 04-063 COTS Capacitor Evaluation
|
| 369. |
Task Plan - 04-064 Pure Tin BOK
|
| 370. |
Task Plan - 04-065 Pure Tin Develop Risk Mitigation Strategy
|
| 371. |
Task Plan - 04-066 NASA Parts Selection List (NPSL) Maintenance and New Development
|
| 372. |
Task Plan - 04-067 Advanced Polymer Electrolytic Capacitors
|
| 373. |
Task Plan - 04-068 Very Small Passive Parts Guidelines
|
| 374. |
Task Plan - 04-069 Aerospace Certified COTS
|
| 375. |
Task Plan - 0471 Architecture Evaluation
|
| 376. |
Task Plan - 05-001 EEPROM BOK
|
| 377. |
Task Plan - 05-004a Lead-Free Survey BOK
|
| 378. |
Task Plan - 05-005 Scaled CMOS Reliability-Preliminary Study
|
| 379. |
Task Plan - 05-009A NDE, NDI: BOK and NASA Equipment Survey
|
| 380. |
Task Plan - 05-011 Matrix Antifuse PROM Reliability
|
| 381. |
Task Plan - 05-012 Tantalum Polymer Capacitors
|
| 382. |
Task Plan - 05-016A COTS PEMS Guide and Testing
|
| 383. |
Task Plan - 05-017 0.15mm CMOS Imager Process Evaluation
|
| 384. |
Task Plan - 05-019A FPGA BOK
|
| 385. |
Task Plan - 05-020A ASIC Technology
|
| 386. |
Task Plan - 05-021A Programmable Oscillators
|
| 387. |
Task Plan - 05-022A Advanced Processors
|
| 388. |
Task Plan - 05-024A A/D Converters
|
| 389. |
Task Plan - 05-025A COTS DRAMs - BOK
|
| 390. |
Task Plan - 05-032A Laser Diode Reliability BOK
|
| 391. |
Task Plan - 05-034a Embedded Actives
|
| 392. |
Task Plan - 05-054a FPGA Radiation Testing
|
| 393. |
Task Plan - 05-073A NEPAG Support
|
| 394. |
Task Plan - 05-076 High-Voltage Power Device Study
|
| 395. |
Task Plan - 05-077 Reliability of SiGe and SOI Semiconductor Devices in Cryogenic Temperatures
|
| 396. |
Task Plan - 05/026a Mixed Signal Devices in Low/High Temperature
|
| 397. |
Task Plan - 06-005a Scaled CMOS - Reliability
|
| 398. |
Task Plan - 06-012a Tantalum Polymer Capacitors - Reliability
|
| 399. |
Task Plan - 06-0169b FPGAs - Volatile - Reliability
|
| 400. |
Task Plan - 06-032bG Fiber Optic Devices - Reliability
|
| 401. |
Task Plan - 06-032bJ
|
| 402. |
Task Plan - 06-081 SiGe and Advanced Mixed Signal - Radiation
|
| 403. |
Task Plan - 06-089 Fiber Optic Devices - Radiation
|
| 404. |
Task Plan - 06-281 SiGe and Advanced Mixed Signal - Reliability
|
| 405. |
Task Plan - 06-282G FPGAs Non-Volatile - Reliability
|
| 406. |
Task Plan - 06-282J FPGAs Non-Volatile - Reliability
|
| 407. |
Task Plan - 06-284 Emerging Non-Volatile Memories - Reliability
|
| 408. |
Task Plan - 06-285 Mass Storage Memories - Reliability
|
| 409. |
Task Plan - 06-286 Power MOSFETs - Reliability
|
| 410. |
Task Plan - 06-287 Wide Band Gap Technology - Reliability
|
| 411. |
Task Plan - 06-296 RF Technologies - Reliability
|
| 412. |
Task Plan - 06-297 Embedded ESD Protection - Reliability
|
| 413. |
Task Plan - 06-298 MEMS - Reliability
|
| 414. |
Task Plan - 07-270 Reliability Effects of Surge Current Testing
|
| 415. |
Task Plan - 07-271 Testing DC/DC Converters for Stability
|
| 416. |
Task Plan - 07-281 Reliability of Silicon Germanium, SOI, and Mixed Signal Devices for Cryogenic
|
| 417. |
Task Plan - 08-001-1
|
| 418. |
Task Plan - 08-002-1 Effect of Mechanical Stresses on Ceramic Capacitors
|
| 419. |
Task Plan - 08-003-2 Factors Affecting Reliability of Solid Tantalum Capacitors
|
| 420. |
Task Plan - 08-004-2 Early Oscillation Detection Techniques for Hybrid DC/DC Converters
|
| 421. |
Task Plan - 08-100-3 Gate Disturbances in Flash Memories
|
| 422. |
Task Plan - 08-101-5 SRAM Based Reprogrammable FPGA
|
| 423. |
Task Plan - 08-102-4
|
| 424. |
Task Plan - 08-104-1RF Device Technology Reliability
|
| 425. |
Task Plan - 1Evaluation of SOI Processes for Mixed Signal ASICs - EPAR FY00
|
| 426. |
Task Plan - Advanced Microwave Power Amplifier Reliability
|
| 427. |
Task Plan - Advanced Polymer Electrolytic Capacitors
|
| 428. |
Task Plan - Advanced, Low-Power Memory Qualification
|
| 429. |
Task Plan - CGaAs (CHFET) Reliability
|
| 430. |
Task Plan - Compound Semiconductor Reliability
|
| 431. |
Task Plan - COTS MEMS Technology Assessment
|
| 432. |
Task Plan - DC-DC Converter Reliability
|
| 433. |
Task Plan - DC/DC Converter Reliability
|
| 434. |
Task Plan - Electronics for Extreme Environments
|
| 435. |
Task Plan - Electronics For Extreme Environments
|
| 436. |
Task Plan - Electronics for Extreme Environments
|
| 437. |
Task Plan - Evaluation of Rework Method Using Low Temperature Solder Metallurgy
|
| 438. |
Task Plan - Evaluation of Silicon on Insulator (SOI) Processes for Mixed Signal ASICs - EPAR FY01
|
| 439. |
Task Plan - FPGA Burn-In Test Evaluation
|
| 440. |
Task Plan - FPGA Reliability Evaluation
|
| 441. |
Task Plan - Hermeticity Effects on GaAs and InP Devices
|
| 442. |
Task Plan - High Density FPGA Qualification
|
| 443. |
Task Plan - Investigation for Reliability of Optical Fiber Modulators for High Speed Applications in Space Fligh
|
| 444. |
Task Plan - IPPAQ - Optoelectronics Technology
|
| 445. |
Task Plan - IPPAQ - SIAP/SOAC
|
| 446. |
Task Plan - Lead-free Solder Implementation
|
| 447. |
Task Plan - Long Life Electronics
|
| 448. |
Task Plan - Long Term Storage Effects
|
| 449. |
Task Plan - MEMS Device Reliability
|
| 450. |
Task Plan - MEMS Reliability Assurance
|
| 451. |
Task Plan - MEMS Reliability Assurance
|
| 452. |
Task Plan - MEMS Tribology
|
| 453. |
Task Plan - MEMS Tribology/Reliability
|
| 454. |
Task Plan - Mixed Signal Devices for Low/High Temperature
|
| 455. |
Task Plan - ONE NASA PARTS PLAN
|
| 456. |
Task Plan - Optoelectronic and Photonic Devices
|
| 457. |
Task Plan - Optoelectronics and Photonics Devices
|
| 458. |
Task Plan - Optoelectronics Reliability
|
| 459. |
Task Plan - Preliminary reliability guidelines for commercially available porous low-k materials for interlayer
|
| 460. |
Task Plan - Reliability Evaluation of Emerging NVMs
|
| 461. |
Task Plan - Reliability Evaluation of Ultra Fine Conductors and Contacts
|
| 462. |
Task Plan - Reliability of Cu-Based Metallization Systems
|
| 463. |
Task Plan - Reliability of Cu-based microelectronic metallization systems
|
| 464. |
Task Plan - Reliability of Cu-Based Microelectronic Metallization Systems
|
| 465. |
Task Plan - Reliability of High Power Diode Laser Arrays
|
| 466. |
Task Plan - Reliability of HTS Microwave Devices
|
| 467. |
Task Plan - Reliability of Laser Arrays
|
| 468. |
Task Plan - Reliability of RF devices for space applications
|
| 469. |
Task Plan - SEMATECH Interaction
|
| 470. |
Task Plan - SEMATECH Interactions
|
| 471. |
Task Plan - SiGe/Si HBT Microwave Devices
|
| 472. |
Task Plan - SiGe/Si HBT Reliability Study
|
| 473. |
Task Plan - SoC Qual Methodology
|
| 474. |
Task Plan - Study of an Integrated Reliability evaluation test and validation of devices for long space mission
|
| 475. |
Task Plan - zzTask-9999
|
| 476. |
Task Plan01XX - Evaluation of Silicon on Insulator (SOI) Processes for Mixed Signal ASICs
|
| 477. |
Technology Readiness Overview: Embedded Actives
|
| 478. |
Technology Readiness Overview: Low-k interlevel dielectrics technology
|
| 479. |
Technology Readiness Overview: Mixed Signal Devices for Very Low Temperatures
|
| 480. |
Technology Readiness Overview: Reliability of Advanced Microcircuit Metallization Systems
|
| 481. |
Technology Readiness Overview: Reliability of III-V radio frequency (RF) devices
|
| 482. |
Technology Readiness Overview: RF MEMS Switches
|
| 483. |
TEM Study of InGaAs/GaAs Structural Evolution Near the Stranski-Krastanow Transformation (Poster)
|
| 484. |
Test Flows for Space PEMs
|
| 485. |
The application of PEMS in space.pdf
|
| 486. |
The opportunities and complexities of applying comercial off the shelf components.pdf
|
| 487. |
The Perry Initiative and the use of PEMS in Military Equipment
|
| 488. |
Thermal and Mechanical Reliability of Five COTS MEMS Accelerometers
|
| 489. |
Thermal Cycling Characterization of Complementary heterostructure Field Effect Transistors (CHFETs)
|
| 490. |
Thermal Evaluation of Fiber Bragg Gratings at Extreme Temperatures
|
| 491. |
Thermal Impedance Measurements for Quality Assessment of Metallurgically Bonded Diodes
|
| 492. |
Thermo-Mechanical Characterization of Motorola MMA1201P Accelerometer Test Report
|
| 493. |
TI Device Change Notice 06/21/02
|
| 494. |
US Airforce Position on Tin Useage
|
| 495. |
Use of PEMs in Military Equipment
|
| 496. |
Using Infrared Imaging to Evaluate Bond Uniformity in Si Structures: JPL Meso-Gyro Failure Analysis
|
| 497. |
Video: Kilowatt Diode Laser Array Performance - Part 1
|
| 498. |
Video: Kilowatt Diode Laser Array Performance - Part 2
|
| 499. |
Video: Kilowatt Diode Laser Array Performance - Part 3
|
| 500. |
Wiring Integrity Technology Assessment
|
| 501. |
X-Band Power GaAs MESFET Investigation
|
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