Tin Whisker Photo of the Month Archive

NASA Goddard Space Flight Center
Photo of the Month

Photo of the Month Archive

April 2004	Limitation of Hot Solder Dip as a Tin Whisker Mitigation Strategy
December 2003	Tin-Lead (Sn-Pb) Whiskers on REFLOWED Die Attach Solder Used in the Manufacture of Laser Diode Arrays
September 2003	SILVER WHISKERS Growing on Primary Contacts of Low Voltage Circuit Breaker
April 2003	Zinc Whiskers Growing on Zinc-Plated Steel Floor Tiles
November 2002	Whiskers Growing INSIDE of Hermetically Sealed Relays See Also the Video of these Whiskers Moving Due to Gentle Air Currents
April 2002	Field Failure Caused by Tin Whisker Short 20 YEARS after System Fielded
August 2001	Tin Whiskers Growing from the Terminations of Pure Tin Plated Ceramic Chip Capacitors

Responsible NASA Officials: Michael Sampson/NASA GSFC Code 306 Dr. Henning Leidecker/NASA GSFC Code 562	Additional Researchers: Jong Kadesch/Orbital Sciences Corp. Jay Brusse/QSS Group, Inc.	Last Updated: April 20, 2005
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