 | NASA Electronic Parts and Packaging (NEPP) Program 2017 Electronics Technology Workshop |
2017 NEPP Electronics Technology Workshop Available Materials Download All in One ZIP (78MB) |
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| Monday, 26-June | ||
| Time | Title | Presenter |
| 08:00 | Registration | |
| THEME: Advanced Electronic Parts Technologies | ||
| 09:00 | NEPP Technology Planning | Ken LaBel NEPP Co-Manager |
| 09:30 | Processors (Radiation) | Steve Guertin JPL |
| 10:00 | Graphics Processor Units (GPUs) | Ed Wyrwas Lentech/GSFC |
| 10:30 | BREAK | |
| 11:00 | Field Programmable Gate Arrays (Radiation) | Melanie Berg AS&D/GSFC |
| 11:30 | Non-Volatile Memories | Jean Yang Scharlotta JPL |
| 12:00 | Lunch (1 Hour 30 Minutes) | |
| 13:30 | DDR Memories | Ed Wyrwas Lentech / GSFC |
| THEME: Power and Widebandgap | ||
| 14:00 | Silicon Power MOSFETs | Jean-Marie Lauenstein NASA/GSFC |
| 14:30 | Silicon Carbide Power Devices and Integrated Circuits | Jean-Marie Lauenstein NASA/GSFC |
| 15:00 | BREAK | |
| 15:30 | LET Dependence of SEB in 1200V SiC Power MOSFETs: Data and TCAD Results | Prof. Art Witulski Vanderbilt University |
| 16:00 | Gallium Nitride Devices | Leif Scheick JPL |
| 16:30 | Hybrid/DC-DC Status | Peter Majewicz NASA/LaRC |
| 17:00 | End of Day 1 | |
| Tuesday, 27-June | ||
| Time | Title | Presenter |
| 08:00 | Registration | |
| THEME: NASA Electronic Parts Assurance Group (NEPAG) | ||
| 08:30 | NEPP/NEPAG Overview | Mike Sampson NASA/GSFC |
| 09:00 | Parts Standardization Activity Update | Shri Agarwal JPL |
| 09:30 | NEPAG Capacitor and Hermetic Leak Testing Updates | Mike Sampson NASA/GSFC |
| 10:00 | BREAK | |
| 10:30 | Proton Facility Update | Ken LaBel NEPP Co-Manager |
| 11:00 | Safe Operating Area and Single Event Effects for "Schottky Diodes" | Megan Casey NASA/GSFC |
| 11:30 | INVITED: Next Generation Class Y: Fine Pitch Flip Chip on Organic Package Technology | Scott Popelar Cobham |
| 12:00 | Lunch (1 Hour 30 Minutes) | |
| THEME: EEE Parts Laboratory Capabilities | ||
| 13:30 | Criteria Labs | Doug Myron |
| 13:50 | Integra Technologies, LLC | Sultan Lillani |
| 14:10 | Microtech Laboratories, LLC | John Olson |
| 14:30 | Golden Altos | Tim Flaherty |
| 14:50 | Joe Benedetto | |
| 15:10 | BREAK | |
| 15:40 | Beverly Marketing Management | Marti McCurdy |
| 16:00 | Troxel Labs | Ian Troxel |
| 16:20 | DfR Solutions | Craig Hillman |
| 16:40 | EAG Laboratories | Aram Sarkissian |
| 17:00 | End of Day 2 | |
| Wednesday, 28-June | ||
| Time | Title | Presenter |
| 08:00 | Registration | |
| THEME: Alternate Assurance Day | ||
| 08:30 | Challenges for Future Space Systems | David Davis, AFSMC |
| 09:00 | CubeSat Mission Success: 2017 Update (with a closer look at the effect of process management on outcome) | Prof. Michael Swartwout SLU |
| 09:30 | MBSE: Implications for Parts Assurance | John Evans NASA/HQ |
| 10:00 | BREAK | |
| 10:30 | Reliability Assurance of CubeSat Payloads using Bayesian Nets and Radiation-Induced Fault Propagation Models | Prof. Art Witulski Vanderbilt University |
| 11:00 | Telemetry for IC Reliability | Robert Kwasnick, Intel |
| 11:30 | Small Company Approach to Space Mission Assurance | Cubic Aerospace |
| 12:00 | Lunch (1 Hour 30 Minutes) | |
| 13:30 | Increasing Small Satellite Reliability - A Public-Private Initiative |
Michael Johnson NASA/GSFC |
| 14:00 | Small Mission Radiation Hardness Assurance (RHA) | Michael Campola NASA/GSFC |
| 14:30 | Single Event Effects (SEE) Using Classical Reliability Approach | Melanie Berg AS&D/GSFC |
| 15:00 | BREAK | |
| 15:30 | SPECIAL Panel: Risk Mitigation Using Non-Military or Non-Space Grade Products | Panel led by S. Ali Lilani, Integra Technologies, LLC. Participants expected from across industry and government. Contact Sultan.Lilani@integra-tech.com with any questions. |
| 17:00 | End of Day 3 | |
| Thursday, 29-June | ||
| Time | Title | Presenter |
| 08:00 | Registration | |
| THEME: Advanced Packaging | ||
| 08:30 | 3D Technology Overview | Doug Sheldon JPL |
| 09:00 | PBGA & QFN | Reza Ghaffarian JPL |
| 09:30 | Ultra High Density System in a Package (SiP) | Bruce Barbara Aurora Semiconductor |
| 10:00 | BREAK | |
| 10:30 | DDR4 & TSC | Jong-ook Suh JPL |
| 11:00 | Xilinx Stacked Silicon Interconnect Technology | Raghu Chaware/Henley Liu Xilinx |
| 11:30 | Wafer Level TSV Technology | Reza Ghaffarian JPL |
| 12:00 | Lunch (1 Hour 30 Minutes) | |
| THEME: HiREV | ||
| 13:30 | TSV Integrated Package Technologies | Hamid Eslampour Global Foundries |
| 14:00 | A Tale of Two FETs - FinFET & FDSOI | Scott Bukofsky Global Foundries |
| 14:30 | 2.5/3D Integration: A Difficult but Necessary Component of Next Gen Systems |
John Behnke Novati |
| 15:00 | Trusted Fabrication Through 3D Integration | Paul Franzon NCSU |
| 15:30 | End of Day 4 | |
| End of Workshop | ||
NEPP Co-Managers: Ken LaBel and Mike Sampson
Site Curator: Carl Szabo