|
NASA Goddard Tin Whisker Experiments |
| The
following section contains information about NASA
Goddard Space Flight Center (GSFC) experiments related to tin whisker growth
and mitigation. Initially, GSFC began experiments in late 1998 aimed at studying the effectiveness of Conformal Coat at
reducing the risk of potentially catastrophic failures caused by tin
whiskers. Since that time various additional experiments (as noted
below) have been initiated. |
| Experiment #1:
COMPLETE!
|
Experiment
#2: ONGOING! Last Updated - April 5, 2002
|
Experiment
#3: FUTURE WORK! |
Characterize the Voltage Breakdown
Strength of Uralane 5750 Conformal Coat Material
|
Characterize the Effectiveness
of Uralane 5750 Conformal Coat Material in Prohibiting Tin Whisker Formation
and/or Tin Whisker Penetration
|
Characterize the Effectiveness
of Uralane 5750 Conformal Coat Material in Preventing the Formation of
a Sustained Plasma Arc Initiated by a Tin Whisker Short Circuit in a Vacuum
Environment
POSSIBLE FUTURE WORK!! |
| Experiment
#4: Ongoing |
Experiment
#5: Ongoing |
Experiment
#6: |
| Demonstration
of Electrostatic Forces Bending a Tin Whisker
|
Analyze
Tin Whiskers Growing on the Pure Tin Terminations of a Ceramic Chip Capacitor
|
Demonstrate
the Growth Behavior of Tin Whiskers through Movie Simulation
|
| Experiment
#7: Ongoing |
|
|
|
Examination of Tin Whisker Growth on Matte Tin
Finished IC Leadframes
|
|
|
