NASA
GSFC Experiments

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NASA Goddard Tin Whisker Experiments

The following section contains information about NASA Goddard Space Flight Center (GSFC) experiments related to tin whisker growth and mitigation.  Initially, GSFC began experiments in late 1998 aimed at studying the effectiveness of Conformal Coat at reducing the risk of potentially catastrophic failures caused by tin whiskers.  Since that time various additional experiments (as noted below) have been initiated.
Experiment #1: COMPLETE! Experiment #2: ONGOING!  Last Updated - April 5, 2002   Experiment #3: FUTURE WORK!
Characterize the Voltage Breakdown Strength of Uralane 5750 Conformal Coat Material

Characterize the Effectiveness of Uralane 5750 Conformal Coat Material in Prohibiting Tin Whisker Formation and/or Tin Whisker Penetration


Characterize the Effectiveness of Uralane 5750 Conformal Coat Material in Preventing the Formation of a Sustained Plasma Arc Initiated by a Tin Whisker Short Circuit in a Vacuum Environment

 

POSSIBLE FUTURE WORK!!

Experiment #4: Ongoing Experiment #5:  Ongoing Experiment #6:
Demonstration of Electrostatic Forces Bending a Tin Whisker

Analyze Tin Whiskers Growing on the Pure Tin Terminations of a Ceramic Chip Capacitor

Demonstrate the Growth Behavior of Tin Whiskers through Movie Simulation

Experiment #7: Ongoing    

Examination of Tin Whisker Growth on Matte Tin Finished IC Leadframes 



   
 

 

Responsible NASA Officials:

   Michael Sampson/NASA GSFC Code 306
   Dr. Henning Leidecker/NASA GSFC Code 562
Additional Researchers: 

   Jong Kadesch/Orbital Sciences Corp.
   Jay Brusse/Perot Systems

Last Updated:

February 22, 2007

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This website provides information about tin whiskers and related research. The independent research performed during the past 50+ years is so vast that it is impractical to cover all aspects of tin whiskers in this one resource. Therefore, the absence of information in this website about a particular aspect of tin whiskers should NOT be construed as evidence of absence.

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