September
2003
"Degradation
of Power Contacts in Industrial Atmosphere: Silver Corrosion and Whiskers",
Dr. Bella H. Chudnovsky, 48th IEEE Holm Conference on Electrical Contacts
2002
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Photos Available Courtesy of Dr. Bella H. Chudnovsky
Photo Courtesy of Dr. Bella Chudnovsky -
(formerly of Schneider Electric/Square D) 513-459-7692
NOTE: The growth mechanism of SILVER WHISKERS is NOT believed
to be analogous to Tin and Zinc Whisker formation. Nevertheless,
whiskers formed on silver-coated contacts in a sulfur-rich environment
pose a serious reliability hazard.
Expansive growth of silver whiskers has been found on
primary current conductors of circuit breakers in switchgear at pulp
recycling mill. The major environmental factor to initiate the growth is
relatively low concentration of Hydrogen Sulfide (H2S). As soon
as a thick enough layer of silver sulfide has been formed, metal filaments
start to grow virtually everywhere but most intensely in locations usually
having elevated temperature while electrical units are energized. Just in
two months after previous cleaning, the whisker grows up to several inches
(6-8 cm) long and up to 0.04 in (1 mm) thick. Most of the whiskers are
made of silver with 1-3 % of copper. The surface of the whiskers long
exposed to atmosphere is contaminated with silver sulfide. The growth
eventually leads to catastrophic thermal failure.