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Notes for NASA-STD-8739.3

Notes for NASA-STD-8739.3

The following are notes on NASA-STD-8739.3, the Workmanship standard for Soldered Connections. The information herein does not represent formal requirements but is provided as guidance.

NOTE 1.  Managing Quality Assurance for Water Soluble Flux: 

Explanation and guidance is provided for reviewers of requests for use of this material on mission hardware in this Presentation.

NOTE 2:  NASA Adoption of J-STD-001xS.1 Space Addendum for Soldering:

NASA Programs and Projects starting after 2011 (see publication date associated with NPD 8730.5, Change 1) are required to baseline IPC J-STD-001ES rather than NASA-STD-8739.2 and NASA-STD-8739.3 in their mission assurance requirements that are flown to developers and suppliers of applicable hardware.  Impacts and options associated with the enabling the Agency policy to track with updates to the J-STD-001xS revision letter are being examined.  Until further study and decisions are achieved, NPD 8730.5 will continue to carry a specific revision letter. 

NOTE 3:  Clarification of "Special Processes" in paragraph 4.1.3

In the current NASA Workmanship requirements corpus, this requirement is found and clarified in NASA-STD-8739.6, 4.3.2.