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Latest NEPP Deliverables
Why NASA and the Space Electronics Community Cares About Cyclotrons - LaBel 2017...
Principle Investigator: Ken LaBel | Upload Date: 02/14/19
Current Status and Future Challenges in Risk-Based Radiation Engineering - Pelli...
Principle Investigator: Ken LaBel | Upload Date: 02/14/19
Electrical, Electronic and Electromechanical (EEE) Parts in the New Space Paradi...
Principle Investigator: Ken LaBel | Upload Date: 02/14/19
Analyzing System on A Chip Single Event Upset Responses using Single Event Upset...
Principle Investigator: Melanie Berg | Upload Date: 02/14/19
Testing the Tester: Lessons Learned During the Testing of a State-of-the-Art Com...
Principle Investigator: Carl Szabo, Jr. | Upload Date: 02/14/19
Testing the Tester: Lessons Learned During the Testing of a State-of-the-Art Com...
Principle Investigator: Carl Szabo, Jr. | Upload Date: 02/14/19
Radiation Hardness Study on SiC Power MOSFETs - ICSCRM 2017 Poster
Principle Investigator: Jean-Marie Lauenstein | Upload Date: 02/14/19
Incidents and Accidents: The Way of the Single Event Tester - LaBel TNS 2017 RAD...
Principle Investigator: Ken LaBel | Upload Date: 02/14/19
A Year in the Life of the NASA Electronic Parts and Packaging (NEPP) Program - L...
Principle Investigator: Ken LaBel | Upload Date: 02/14/19
Protons, Aerospace, and Electronics: A National Interest - LaBel PTCOG 2017 Pres...
Principle Investigator: Ken LaBel | Upload Date: 02/14/19
NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance, An Over...
Principle Investigator: Ken LaBel | Upload Date: 02/14/19
The NASA Electronic Parts and Packaging (NEPP) Program - NASA Items of Interest ...
Principle Investigator: Ken LaBel | Upload Date: 02/14/19
Echoes of the Past, Glimpses of the Future - Ongoing Trends in Assurance of EEE ...
Principle Investigator: Ken LaBel | Upload Date: 02/14/19
NASA Electronic Parts and Packaging (NEPP) Program, Discussion of Highly Acceler...
Principle Investigator: Alexander Teverovsky | Upload Date: 02/14/19
Proton Testing of nVidia GTX 1050 GPU, Part 2
Principle Investigator: Edward Wyrwas | Upload Date: 10/03/18
Body of Knowledge for Graphics Processing Units (GPUs) - 2018 NEPP BOK Paper
Principle Investigator: Edward Wyrwas | Upload Date: 10/03/18
Update - Body of Knowledge (BOK) for Copper Wire Bonds - 2018 BOK Paper
Principle Investigator: Michael Sampson | Upload Date: 10/03/18
2.5/3D Daisy Chain Reliability Evaluation - NEPP-BOK-2018 Paper
Principle Investigator: Reza Ghaffarian | Upload Date: 10/03/18
Xilinx Kintex-UltraScale Field Programmable Gate Array Single Event Effects (SEE...
Principle Investigator: Melanie Berg | Upload Date: 06/28/18
Extreme Temperature Performance of Automotive-Grade Small Signal Bipolar Junctio...
Principle Investigator: Kristen Boomer | Upload Date: 02/28/18
Susceptibility to Cracking of Different Lots of CDR35 Capacitors - Test Report
Principle Investigator: Alexander Teverovsky | Upload Date: 02/28/18
 

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