NASA Goddard Space Flight Center
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Photo of the Month Archive
April 2004 Limitation of Hot Solder Dip as a Tin Whisker Mitigation Strategy

hot-dip-limit-large.jpg (70097 bytes)

December 2003 Tin-Lead (Sn-Pb) Whiskers on REFLOWED Die Attach Solder Used in the Manufacture of Laser Diode Arrays

2003Dec-Sn-Pb-Whisker.jpg (40014 bytes)

September 2003 SILVER WHISKERS Growing on Primary Contacts of Low Voltage Circuit Breaker

AgWhisk-PrimCont_after fail1.jpg (62059 bytes)

April 2003 Zinc Whiskers Growing on Zinc-Plated Steel Floor Tiles

zinc-whisker-floor.jpg (51141 bytes)

November 2002 Whiskers Growing INSIDE of Hermetically Sealed Relays

See Also the Video of these Whiskers Moving Due to Gentle Air Currents

April 2002 Field Failure Caused by Tin Whisker Short 20 YEARS after System Fielded

August 2001 Tin Whiskers Growing from the Terminations of Pure Tin Plated Ceramic Chip Capacitors

Responsible NASA Officials:

   Michael Sampson/NASA GSFC Code 306
   Dr. Henning Leidecker/NASA GSFC Code 562
Additional Researchers: 

   Jong Kadesch/Orbital Sciences Corp.
   Jay Brusse/QSS Group, Inc.

Last Updated:

April 20, 2005

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