Re-emergence of an Old Problem with Potentially Catastrophic Consequences

NASA Goddard Space Flight Center
Re-emergence of an Old Problem with Potentially Catastrophic Consequences

Any component with a pure tin plated surface is susceptible to whisker growth but certain relays may represent a greater risk because of:

(~ 60 mils)

	Failure history
	Spacing between tin plated surfaces
	Applied voltages (20 - 50 volts)
	Plating characteristics that seem particularly prone to whisker growth

	Hardware built in 1990’s time frame may be at risk.
	Manufacturer’s certification of plating may be unreliable
	Many programs may be unaware of having pure tin-plated hardware in their spacecraft or instrument

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Responsible NASA Officials: Michael Sampson/NASA GSFC Code 306 Dr. Henning Leidecker/NASA GSFC Code 562	Additional Researchers: Jong Kadesch/Orbital Sciences Corp. Jay Brusse/QSS Group, Inc.	Last Updated: April 20, 2005
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