|
Specification
Number
|
Current Specification
Revision Date
|
Current Tin
Prohibition Language or Comments
|
Revision when
Pure Tin Prohibition Language was Added
|
| |
|
|
|
|
Capacitors
|
| |
|
|
|
MIL-PRF-20
(Ceramic)
|
05/06/93
Rev H Am 2
|
No
specific tin prohibition language in the spec. However, the packages
are non-metallic and leads are commonly solder dipped by users prior
to use. |
|
MIL-PRF-123
(Ceramic)
|
07/06/98
Rev B Am 5
|
Pure
tin is allowed on chip capacitor terminations only. Termination type
"W" allows either pure tin or tin-lead terminations. |
|
MIL-PRF-23269
(Glass)
|
08/06/93
Rev E Am 1
|
3.5.2.3
Tin plated finishes. Use of tin plating is prohibited as a final finish
and as an undercoat effective 6 months from the date of this specification
(see 6.10). Use of tin-lead (Sn-Pb) finishes are acceptable
provided taht the minimum lead content is 3 percent.
6.10 Tin plated
finishes. Tin plating is prohibited (see 3.5.2.3) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information
on this matter, see ASTM B 545 (Standard Specification for Electrodeposited
Coating of Tin).
|
08/06/93
Rev E Am 1
|
MIL-PRF-39003
(Tantalum)
|
05/22/98
Rev H Am 4
|
"3.5.3
Tin plated finishes. Tin plating is prohibited as a final finish or
an undercoat. Tin-lead (Sn-Pb) finishes are acceptable provided that
the minimum lead content is three percent (see 6.8)."
"6.8 Tin plated
finishes. Tin plating is prohibited (see 3.5.3) because it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information,
see ASTM B 545 (Standard Specification for Electrodeposited Coating
of Tin).
|
08/06/93
Rev H Am 2
|
MIL-PRF-39006
(Tantalum)
|
07/07/98
Rev E Am 1
|
(NOTE:
THE WAY THIS IS WRITTEN, THIS IS A TERMINAL REQUIREMENT ONLY)
3.5.1 Case.
Each capacitor shall be enclosed in a hermetically-sealed or nonhermetically-sealed
metal case (see 3.1) which will prevent leakage or evaporation of
the electrolyte and will protect the capacitor element against the
entry of contaminants.
3.5.2 Terminals.
3.5.2.2 Tin
plated finishes. Tin plating is prohibited as a final finish or
as an undercoat. Tin-lead (Sn-Pb) finishes are acceptable provided
that the minimum lead content is 3 percent (see 6.10).
6.10 Tin plated
finishes. Tin plating is prohibited (see 3.5.2.2) because it may
result in tin whisker growth. Tin whisker growth could adversely
affect the operation of electronic equipment systems. For additional
information, see ASTM B545, Standard Specification for Electrodeposited
Coating of Tin.
|
12/24/93
Rev D Am 1
|
MIL-PRF-39014
(Ceramic)
|
09/16/97
Rev F
|
For
Terminal Lead Finish "3.5.1.1 Tin plated finishes. Tin plating is
prohibited as a final finish or as an undercoat. Tin-lead (Sn-Pb)
finishes are acceptable provided that the minimum lead content is
three percent (see 6.7).
6.7 Tin plated
finishes. Tin plating is prohibited (see 3.5.1.1) because it may
result in tin whisker growth. Tin whisker growth could adversely
affect the operation of electronic equipment systems. For additional
information, see ASTM B545, "Standard Specification for Electrodeposited
Coating of Tin."
|
11/23/93
Rev E Am 4
|
MIL-PRF-49467
(Ceramic)
|
07/15/98
Rev A Am 2
|
3.5.1.2
Tin plated finishes. Tin plating is prohibited as a final finish or
as an undercoat. Tin-lead (Sn-Pb) finishes are acceptable provided
that the minimum lead content is 3 percent (see 6.5).
6.5 Tin plated
finishes. Tin plating is prohibited (see 3.5.1.2) because it may
result in tin whisker growth. Tin whisker growth could adversely
affect the operation of electronic equipment systems. For additional
information, see ASTM B545, "Standard Specification for Electrodeposited
Coatings of Tin".
|
05/19/97
Rev A
|
MIL-PRF-49470
(Ceramic)
|
07/15/98
Am 1
|
3.5.1.2
Tin plated finishes. Tin plating is prohibited as a final finish or
as an undercoat. Tin-lead (Sn-Pb) finishes are acceptable provided
that the minimum lead content is 3 percent (see 6.5).
6.5 Tin plated
finishes. Tin plating is prohibited (see 3.5.1.2) because it may
result in tin whisker growth. Tin whisker growth could adversely
affect the operation of electronic equipment systems. For additional
information, see ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
11/19/97
Base
|
MIL-PRF-55365
(Tantalum)
|
04/13/98
Rev D Am 1
|
For
Terminals…" 3.5.2.3 Tin plated finishes. Tin plating is prohibited
as a final finish or as an undercoat. Tin-lead (Sn-Pb) finishes are
acceptable provided that the minimum lead content is 3 percent (see
6.10)."
6.10 Tin plated
finishes. Tin plating is prohibited (see 3.5.2.3) because it may
result in tin whisker growth. Tin whisker growth could adversely
affect the operation of electronic equipment systems. For additional
information, see ASTM B545, "Standard Specification for Electrodeposited
Coating of Tin."
|
08/02/93
Rev C Am 4
|
MIL-PRF-55681
(Ceramic)
|
06/29/98
Rev E Am 1
|
Spec
does not prohibit pure tin. Termination "W" allows pure tin or tin-lead
finish.
A NOTE ONLY.
Not a Requirement
6.11 Tin plated
finishes (100 percent). MIL-PRF-55681 capacitors have not historically
had a problem with tin whisker growth. However, tin whisker growth
could adversely effect the operation of electronic equipment systems.
For additional information, see ASTM B545, "Standard Specification
for Electrodeposited Coating of Tin".
|
07/13/94
Rev D
|
MIL-PRF-83421
(Film)
|
12/30/93
Rev B Am 3
|
3.5.3.4Tin
Plated Finishes. Tin plating is prohibited as a final finish or as
an undercoat. Tin lead finishes are acceptable provided that the minimum
lead content is 3 percent.
6.8 Tin plated
finishes. Tin plating is prohibited since it may result in tin whisker
growth. Tin whisker growth could adversely affect the operation
of electronic equipment systems. For additional info on this matter,
refer to ASTM B545
|
07/04/93
Rev B
|
MIL-PRF-87217
(Film)
|
02/23/94
Am 4
|
Pure
tin is not expressly disallowed. However, these parts are made as
MIL-PRF-83421, so they should be covered by the same prohibition as
in 83421. |
|
| |
|
|
|
|
Connectors
|
| |
|
|
|
|
MSFC 40M38277
|
04/23/91
|
Pure
tin finish is required for type NLS3H solder mount connectors only.
Passivated stainless steel or nickel over aluminum is used on all
other connectors. All contacts are gold plated. |
|
|
MSFC 40M38298
|
03/15/9
|
Pure
tin is required for the shell of type NBS3H hermetic connectors and
for the soldercups of type NBS0H and NBS3H hermetic connectors.
All other connectors are nickel coated. Contacts and engagement
surfaces of hermetic connector contacts are gold plated. |
|
|
MSFC 40M39569
|
06/30/83
|
Pure
tin is required for type NB3H solder mount connector shell only.
All other connectors are passivated stainless steel or nickel coated
aluminum. All contacts are gold plated. |
|
|
GSFC S-311-P-4
|
09/05/91
Rev D
|
No
pure tin allowed. Connectors and contacts are gold plated. |
|
|
GSFC S-311-P-10
|
09/21/92
Rev D
|
No
pure tin allowed. Connectors and contacts are gold plated. |
|
|
GSFC S-311-P-718
|
9/05/91
Base Rev
|
No
pure tin is used on connectors or contacts. Connector shells are nickel
plated or chemically treated. Contacts are gold plated. |
|
|
MIL-C-5015
|
03/15/94
Rev G Am 5
|
No
pure tin is used on connectors or contacts. Soldercup contacts
are pretinned with Sn60 tin-lead solder inside the solder well. |
|
|
MIL-PRF-24308
|
11/12/97
Rev D Am 2
|
Pure
tin is required on Class H (Hermetic) shells and contact bodies.
Latest revision of MIL-PRF-23408/9 is not clear on material and finish
for space. Page 1 and 2 are in conflict. ; Page 1 lists
Class K while page 2 lists Class M non-magnetic. Previous revision
listed space grade to be Class K. |
|
|
MIL-C-26482
|
01/03/91
Rev G Am 5
|
Pure
tin is required for Series 1 and 2 hermetic seal connectors.
Series 1 solder type contacts are also pure tin plated. |
|
|
MIL-PRF-83513
|
04/22/97
Rev D
|
No
pure tin is used. Space grade connectors are coated with electroless
nickel. |
|
|
MIL-PRF-39012
|
08/25/95
Rev D Am 1
|
No
pure tin is used. Beryllium copper connectors are gold plated.
Stainless steel connectors are passivated. Contacts are gold
plated on all surfaces. |
|
|
MIL-C-83517
|
07/07/98
Am 4
|
No
pure tin is used. Solder type contacts are gold plated.
Connector body is stainless steel. Finish is passivated or gold
plated. Contact is gold plated. |
|
|
MIL-C-38999
|
04/06/90
Rev J
|
Pure
tin is required for Series I and II hermetic seal connectors only.
Solder contacts for hermetic connectors are gold plated.
The current
unreleased Rev K draft includes a pure tin prohibition with 3% lead
minimum.
|
|
|
MIL-C-39029
|
05/02/88
Rev E
|
No
pure tin is allowed. Solderless wrap termination areas and certain
solder terminated contacts are pre-tinned with tin-lead alloy |
|
|
MIL-C-55302
|
04/09/86
Rev E
|
No
pure tin is allowed. Solder contact termination end plating
is tin-lead (50-70%) composition. |
|
|
MIL-C-85049
|
08/30/90
Rev A
|
No
pure tin is used. |
|
| |
|
|
|
|
Crystals
|
| |
|
|
|
|
MIL-O-55310
|
03/25/98
Rev D
|
3.5.4
Package body finish. External metallic package elements other than
leads or terminals (e.g., lids, covers, bases, seal rings, etc.) shall
meet the applicable corrosion resistance and environmental requirements
and shall be finished so that they meet those requirements using finishes
conforming to one or more of the following as applicable:
a. Hot solder
dip.
NOTE: Pure tin
finish shall not be used on any internal or external package surface
or as a lead finish. In addition, tin plating shall not be used
as an undercoat. For further guidance on these package body finishes,
see 6.5.3.
6.5.2 Guidance
on lead finishes. The following lead finishes should be considered
for meeting the performance requirements of this specification:
a. Hot solder
dip. The hot solder dip should be homogeneous with a minimum thickness
of 60 microinches (1.52 m) for round leads and, for other shapes,
a minimum thickness at the crest of the major flats of 200 microinches
(5.08 m) solder (SN60 or SN63). In all cases, the solder dip should
extend up to and beyond the effective seating plane for packages
with standoffs or within .030 inch (0.76 mm) of the lead or package
interface for leaded flush mounted oscillators. For leadless chip
carrier oscillators, the hot solder dip should cover a minimum of
95 percent of the metallized side castellation or notch and metallized
areas above and below the notch except the index feature if not
connected to the castellation. Terminal area intended for oscillator
mounting should be completely covered. The hot solder dip is applicable:
(1) Over a finish
in accordance with entry 6.5.2b or 6.5.2c, or
(2) Over electroplated
nickel or electroless nickel phosphorous (see 6.5.4), or
(3) Over the
basis metal. When applied over the basis metal, underplate that
is nonconforming, or other finishes that are nonconforming (e.g.,
fused tin less than 200 microinches (5.08 m)), hot solder dip should
cover the entire lead to the glass seal or point of emergence of
the lead or metallized contact through the package wall.
b. Tin-lead
plate. Tin-lead plating should have in the plated deposit 3 percent
to 50 percent by weight lead (balance nominally tin) homogeneously
co-deposited. Plated tin-lead should be a minimum of 300 microinches
(7.62 m) thick. Plated tin-lead should contain no more than 0.05
percent by weight co-deposited organic material measured as elemental
carbon. Tin-lead plate is applicable:
(1) Over electroplated
nickel or electroless nickel phosphorous (see 6.5.4).
(2) Over the
basis metal.
6.5.3 Guidance
on package finishes. The following package finishes should be considered
for meeting the performance requirements of this specification:
a. Solder in
accordance with 6.5.2a. |
03/15/94
Rev C
|
| |
|
|
|
|
Discrete
Semiconductors (Diodes/Transistors)
|
| |
|
|
|
|
MIL-S-19500
|
09/08/97
Rev K Am 1
|
Appendix
H—CRITICAL INTERFACE AND MATERIALS H.4.1.1.3 Tin and tin-lead plate.
Pure tin finish shall not be used on any internal or external package
or lead surface. Lead finish shall not use pure tin. Tin-lead plate
shall contain three percent lead as a minimum (see table XVII). Pure
tin finish (including pure tin undercoating) shall be prohibited.
For the JAN level only, pure tin is acceptable in accordance with
table XVII. Herein. |
04/15/94
Rev J
|
| |
|
|
|
|
Filters
|
| |
|
|
|
|
MIL-PRF-15733
|
11/15/96
Rev G Am 5
|
3.4.3Finish.
All exposed metallic surfaces shall be suitably protected against
corrosion by plating, lead alloy coating, or other means. The finish
shall provide good electrical contact when used on a terminal or as
a conductor (see 6.4); shall have uniform texture and appearance;
shall be adherent; and shall be free from blisters, pinholes and other
defects that may affect the protective value of the coating. Pure
tin plating is prohibited. When used tin plating shall have a minimum
lead content of 3 percent (see 6.5).
6.5 Tin plated
finish. Tin plating is prohibited (see 3.4.2.1) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information
on this matter, refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin)."
|
12/31/93
Rev G Am 4
|
|
MIL-PRF-28861
|
09/11/98
Rev B Am 4
|
3.6.3.1
Tin-plated or tin-lead plated. T code case finish filters (see 1.2.1.2
and 3.1) shall be tin plated (except that the minimum lead content
shall be 3 percent), tin-lead plated, or hot-solder dipped. Use of
pure tin plating is prohibited. For guidance on tin and tin-lead finishes,
see 6.5.1 and 6.5.2.
6.5 Finishes.
6.5.1 Tin-plated
finish. Pure tin plating is prohibited (see 3.6.3.1) since it may
result in tin whisker growth. Tin whisker growth could adversely
affect the operation of electronic equipment systems. For additional
information on this matter, refer to ASTM B545 (Standard Specification
for Electrodeposited Coating of Tin). Based on past experience,
tin plating in accordance with MIL-T-10727 or electro-tin fused
(with a minimum tin content of 3 percent) has been used successfully
to meet the requirements of this specification.
6.5.2 Tin-lead
plated. Based on past experience, tin-lead plating in accordance
with MIL-P-81728 or hot-solder dipped (40 percent to 60 percent
tin in accordance with ANSI/J-STD-006) has been used successfully
to meet the requirements of this specification.
|
01/31/94
Rev B
|
| |
|
|
|
|
Fuses
|
| |
|
|
|
MIL-PRF-23419
(Fuses)
|
06/12/98
Rev E Am 3
|
3.5.5.4
Tin plating or coating. Tin plating or coating shall conform to MIL-T-10727,
or equivalent as approved by the qualifying activity, except the minimum
lead content shall be 3 percent. (NOTE: Use of pure tin plating is
prohibited as a final finish and as an undercoat effective 6 months
from the date of this specification (see 6.8).)
6.8. Tin plated
finishes. Tin plating is prohibited (see 3.5.5.4) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information
on this matter, refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
06/01/94
Rev E Am 1
|
MIL-PRF-39019
(Circuit Breakers)
|
08/27/97
Rev D
|
No
pure tin prohibition language. |
|
| |
|
|
|
|
Inductors
|
| |
|
|
|
|
MIL-C-39010
|
08/27/97
Rev E
|
3.5.1.1
Solderable/weldable lead terminals. Unless otherwise specified, the
manufacturer shall verify by certification that all leads conform
to type LW(---)C-52 in accordance with MIL-STD-1276 or equivalent.
The maximum thickness of 200 microinches is not applicable. Tin plating
is prohibited on leads as a final finish (see 6.6). Use of tin-lead
(Sn-Pb) finishes are acceptable provided the minimum lead content
is 3 percent.
6.6 Tin plated
finishes. Tin plating is prohibited (see 3.5.1.1) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information
on this matter, refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
01/04/94
Rev D
|
|
MIL-C-83446
|
10/03/94
Rev B Am 4
|
3.4.6
Tin Plated Finishes. Use of tin plating is prohibited as a final finish
and as an undercoat effective 6 months from the date of this specification
(see 6.8) Use of tin-lead (Sn-Pb) finishes are acceptable provided
that the minimum lead content is 3 percent.
6.8 Tin plated
finishes. Tin plating is prohibited (see 3.4.6) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information
on this matter, refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
10/03/94
Rev B Am 4
|
|
MIL-STD-981
|
02/10/94
Rev B
|
Language
exists that restricts the use of pure tin for soldering. However,
no guideline is provided for minimum lead content or for package plating
restrictions/guidelines. |
02/10/94
Rev B
|
| |
|
|
|
|
Microcircuits
|
| |
|
|
|
|
MIL-M-38510
|
08/27/93
Rev J Notice 1
|
No
pure tin prohibition language. |
|
|
MIL-PRF-38534
|
09/12/96
Rev C Am 1
|
APPENDIX
E
GENERIC DESIGN
AND CONSTRUCTION CRITERIA
a. Hot solder
dip. The hot solder dip will be homogeneous with a minimum thickness
of 60 microinches (1.52 Pm) for round leads and, for other shapes,
a minimum thickness at the crest of the major flats of 200 microinches
(5.08 Pm) solder (SN60 or SN63). For leadless chip carrier devices,
the solder will cover a minimum of 95 percent of the metallized
side castellation or notch and metallized areas above and below
the notch (except the index feature if not connected to the castellation).
Terminal area intended for device mounting will be completely covered.
The hot solder dip on leads is applicable to either 1 or 2 below:
(1) Over a finish
in accordance with entry c or d below. The solder will extend within
.030 inch (0.76 mm) of the lead or package interface, or beyond
the effective seating plane for packages with standoffs.
(2) Over the
basis metal or other finishes. When applied over the basis metal,
or over underplate or finishes other than as specified in entry
c or d, solder will cover the entire lead to the glass seal or point
of emergence of the lead or metallized contact through the package
wall.
b. Tin-lead
plate. Tin-lead plate will have in the plated deposit 2 percent
to 50 percent by weight lead (balance nominally tin) co-deposited.
As plated tin-lead will be a minimum of 300 microinches thick and
will contain no more than 0.05 percent by weight co-deposited organic
material (measured as elemental carbon). Tin-lead plating may be
fused by heating above its liquidus temperature. Fused tin-lead
will be a minimum of 200 microinches thick. Tin-lead plate is applicable:
(1) Over a finish
in accordance with entry c below, or
(2) Over the
basis metal.
|
08/23/95
Rev C
|
|
MIL-PRF-38535
|
12/01/97
Rev E
|
APPENDIX
A
CLASS LEVEL
B AND S REQUIREMENTS
A.3.5.6.3 Microcircuit
finishes. Finishes of all external leads or terminals and all external
metal package elements shall conform to either A.3.5.6.3.2 or A.3.5.6.3.3,
as applicable. The lead finish designator (see A.3.6.2.7) shall
apply to the finish of the leads or terminals. The leads or terminals
shall meet the applicable solderability and corrosion resistance
requirements. The other external metallic package elements (including
metallized ceramic elements) shall meet the applicable corrosion
resistance requirements. Finishes on interior elements (e.g. bonding
pads, posts, tabs) shall be such that they meet the lead bonding
requirements and applicable design and construction requirements.
The use of strike plates is permissible to the maximum thickness
of 10 microinches (0.25 micrometer). All plating of finishes and
undercoats shall be deposited on clean, nonoxidized metal surfaces.
Suitable deoxidation or cleaning operations shall be performed before
or between plating processes. All parts shall be capable of meeting
the following requirements of MIL-STD-883:
NOTE: Pure tin
is prohibited on leads and cases as a final finish. Use of tin-lead
finishes are acceptable provided they meet the lead content requirements
herein.
|
03/14/95
Rev C
|
| |
|
|
|
|
Relays
|
| |
|
|
|
|
MIL-PRF-6106
|
12/01/97
Rev K
|
3.4.1.1
Plated finishes.
a. Pure tin
plating is prohibited internally and externally. Tin-lead finish
is acceptable, provided that the minimum lead content is 3 percent.
Other tin alloys are acceptable as approved by the qualifying activity.
b. Pure zinc
plating is prohibited internally and externally.
c. Pure cadmium
plating is prohibited internally and externally.
|
12/01/97
Rev K
|
|
MIL-PRF-39016
|
06/30/98
Rev E Am 2
|
"3.4.1.1
Plated finishes.
a. Use of tin
plating is prohibited internally and externally (see 6.6.4.1). Use
of tin-lead finishes are acceptable provided that the minimum lead
content is 3 percent.
b. Use of zinc
plating is prohibited internally and externally.
c. Use of cadmium
plating is prohibited internally and externally.
6.6.4.1 Tin
Plated Finishes. Use of tin plating is prohibited (see 3.4.1.1)
Use of tin finishes can result in tin whisker growth. Tin whisker
growth can result in adverse effects on the operation of electronic
equipment systems. For additional information on this matter, refer
to ASTM B545-83
|
07/18/94
Rev E
|
|
MIL-PRF-83536
|
12/19/97
Rev A Am 1
|
3.4.1.1
Plated finishes.
a. Pure tin
plating is prohibited internally and externally (see 6.6.4.1). Tin-lead
finish is acceptable, provided that the minimum lead content is
3 percent. Other tin alloys are acceptable as approved by the qualifying
activity.
b. Pure zinc
plating is prohibited internally and externally.
c. Pure cadmium
plating is prohibited internally and externally.
6.6.4.1Tin Plated
Finishes. Use of tin plating is prohibited (see 3.4.1.1) Use of
tin finishes can result in tin whisker growth. Tin whisker growth
can result in adverse effects on the operation of electronic equipment
systems.
|
03/21/97
Rev A
|
| |
|
|
|
|
Resistors
|
| |
|
|
|
|
GSFC S-311-P-672
|
04/06/98
Rev E
|
Information
not available at time of table prep. |
|
|
GSFC S-311-P-683
|
07/02/96
Rev A
|
Information
not available at time of table prep. |
|
|
GSFC S-311-P-742
|
12/26/95
Rev C
|
Information
not available at time of table prep. |
|
MIL-PRF-39005
(Wirewound)
|
03/16/98
Rev E Am 1
|
3.5.2
Tin plated finishes. Use of tin plating is prohibited as a final finish
and as an undercoat (see. 6.12) Use of tin-lead (Sn-Pb) finishes are
acceptable provided that the minimum lead content is 3 percent.
6.12 Tin plated
finishes. Tin plating is prohibited (see 3.5.2) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional Information
on this matter refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
07/01/93
Rev D Am 2
|
MIL-PRF-39007
(Wirewound)
|
07/03/97
Rev H
|
3.5.2.3
Tin plated finishes. Use of tin plating is prohibited (see 6.10.1).
Use of tin lead finishes are acceptable provided that the minimum
lead content is 3 percent.
6.10.1 Tin plated
finishes. Tin plating is prohibited (see 3.5.2.3) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional Information
on this matter refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
03/23/93
Rev G Am 1
|
MIL-PRF-39008
(Carbon Comp)
|
04/11/97
Rev C Notice 1
Inactivated
|
3.5.1.4
Tin plated finishes. Use of tin plating is prohibited as a final finish
and as an undercoat (see. 6.6.1) Use of tin-lead (Sn-Pb) finishes
are acceptable provided that the minimum lead content is 3 percent.
6.12 Tin plated
finishes. Tin plating is prohibited (see 3.5.1.4) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional Information
on this matter refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
05/05/93
Rev C Am 1
|
MIL-PRF-39009
(Wirewound)
|
07/03/97
Rev D
|
3.27
Tin plated finishes. Use of tin plating is prohibited as a final finish
and as an undercoat (see 6.7). Use of tin-lead (Sn-Pb) finishes are
acceptable provided that the minimum lead content is 3 percent.
6.7 Tin plated
finishes. Tin plating is prohibited (see 3.27) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information
on this matter, refer to ASTM B545 (Standard Specification for Electrodeposited
Coatings of Tin).
|
01/27/94
Rev C Am 1
|
MIL-PRF-39015
(Variable)
|
06/09/98
Rev D Am 1
|
3.5.9
Tin plated finishes. Use of tin plating is prohibited as a final finish
and as an undercoat (see 6.13). Use of tin-lead (Sn-Pb) finishes are
acceptable provided that the minimum lead content is 3 percent.
6.13 Tin plated
finishes. Tin plating is prohibited (see 3.5.9) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional Information
in this matter, refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
04/27/93
Rev C Am 2
|
MIL-PRF-39017
(Film)
|
05/19/97
Rev F
|
3.5.3.1
Tin plated finishes. Use of tin plating is prohibited as a finish
and as an undercoat (see 6.14). Use of tin-lead (Sn-Pb) finishes are
acceptable provided that minimum lead content is 3 percent.
6.16 Tin plated
finishes. Tin plating is prohibited (see 3.5.3.1) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional Information
in this matter, refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
07/01/93
Rev E Am 2
|
MIL-PRF-55182
(Film)
|
09/17/98
Rev G Am 3
|
3.5.3.4
Tin plated finishes. Use of tin plating is prohibited as a final finish
and as an undercoat (see 6.8). Use of tin-lead (Sn-Pb) finishes are
acceptable provided that the minimum lead content is 3 percent.
6.8 Tin plated
finishes. Tin plating is prohibited (see 3.5.3.4) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information
on this matter, refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
08/11/93
Rev F Am 2
|
MIL-PRF-55342
(Film)
|
09/17/98
Rev G Am 1
|
3.5.3
Tin plated finishes. Use of tin plating is prohibited as a final finish
and as an undercoat (see 6.4.5). Use of tin-lead (Sn-Pb) finishes
are acceptable provided that the minimum lead content is 3 percent.
6.4.5 Tin plated
finishes. Tin plating is prohibited (see 3.5.3) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information
on this matter refer to ASTM B545.
|
05/10/93
Rev E Am 2
|
MIL-PRF-83401
(Network)
|
03/18/96
Rev G
|
3.4.6
Tin plated finishes. Use of tin plating is prohibited (see 6.4.3.1).
Use of tin-lead finishes are acceptable provided that the minimum
lead content is 3 percent.
6.4.3.1 Tin
plating finishes. Use of tin plating is prohibited (see 3.4.6).
Use of tin finishes can result in the tin whisker growth. Tin whisker
growth can result in adverse effects on the operation of electronic
equipment systems. For additional information on this matter, refer
to ASTM B545 .
|
06/11/93
Rev F Am 3
|
MIL-PRF-914
(Network)
|
12/19/97
Rev A Am 1
|
3.5.6
Tin plated finishes. Use of tin plating is prohibited as a final finish
and as an undercoat (see 6.4.2). Use of tin-lead (Sn-Pb) finishes
are acceptable provided that the minimum lead content is 3 percent.
6.4.2 Tin plated
finishes. Tin plating is prohibited (see 3.5.6) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information
on this matter refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
|
| |
|
|
|
|
Thermistors
|
| |
|
|
|
|
MIL-T-23648
|
06/15/98
Rev D Am 1
|
3.3.3
Tin Plated Finishes. Use of tin plating is prohibited as a final finish
and an undercoat (see 6.8.1) Use of tin-lead (Sn-Pb) finishes are
acceptable provided that the minimum lead content is 3 percent.
6.8.1 Tin plated
finishes. Tin plating is prohibited (see 3.3.3) since it may result
in tin whisker growth. Tin whisker growth could adversely affect
the operation of electronic equipment systems. For additional information
on this matter, refer to ASTM B545 (Standard Specification for Electrodeposited
Coating of Tin).
|
04/15/93
Rev C Am 1
|
|
GSFC S-311-P-18
|
05/12/95
Rev G
|
No
pure tin prohibition language. |
|
| |
|
|
|
|
Transformers
|
| |
|
|
|
|
MIL-T-27
|
06/06/94
Rev E Am 2
|
No
prohibition in base spec. |
|
|
MIL-STD-981
|
02/10/94
Rev B
|
Language
exists that restricts the use of pure tin for soldering. However,
no guideline is provided for minimum lead content or for package plating
restrictions/guidelines. |
02/10/94
Rev B
|
| |
|
|
|
|
Wire
and Cable
|
| |
|
|
|
|
S-311-P-13
|
06/07/96
Rev B
|
Pure
tin is required for all wire
Pure tin coated
wire is recommended for solder applications only. Tin whisker
growth is only a risk in areas where the insulation has been removed
and the wire has not been coated with solder.
|
|
|
MIL-C-17
|
01/08/96
Rev G Am 3
|
Pure
tin is required for the outer conductor of certain dash numbers of
semi-rigid copper clad cable. There is no impact on standard
part numbers used by NASA. |
|
|
J-W-1177
|
10/16/96
Rev B Notice 1
|
Tin
coating is not permitted. The superseding document NEMA MW-1000
does not permit tin plating. |
|
|
MIL-W-22759
|
05/07/91
Rev E Am 1
|
Pure
tin plating is required on some styles including (but not limited
to) /16, /18, /32, /34.
Pure tin coated
wire is recommended for solder applications only. Tin whisker
growth is only a risk in areas where the insulation has been removed
and the wire has not been coated with solder.
|
|
|
MIL-W-81381
|
09/08/87
Rev A Notice 1
|
Pure
tin is required for detail specifications /21 and /22 only.
Pure tin coated
wire is recommended for solder applications only. Tin whisker
growth is only a risk in areas where the insulation has been removed
and the wire has not been coated with solder.
|
|
QQ-W-343
(Bus Wire)
|
04/18/97
Rev G
|
99%
pure tin is required for finish "T" only.
Not likely to
be a concern if tin plated bus wire is solder dipped/coated prior
to use with solder containing a minimum of 3% lead.
EX. Part number
that is pure tin plated: |
|
|
MIL-DTL-27500
|
12/10/97
Rev H
|
Pure
tin is required for shield styles T, V, J and D |
|
