1. L. Panashchenko, M. Osterman,"Examination of Nickel Underlayer as a Tin Whisker Mitigator", Electronic Components and Technologies Conference (ECTC), May 2009, pages 1037-43

   	Paper
   	Presentation

2. S. McCormack, S. Meschter, "Probabilistic Assessment of Component Lead-to-Lead Tin Whisker Bridging", Intl. Conf. on Soldering and Reliability, May 20-22, 2009

3. Courey, K., .; Asfour, S. S.; Onar, A.; Bayliss, J. A.; Ludwig, L. L.; Wright, M. C.,"Tin Whisker Electrical Short Circuit Characteristics—Part II", Electronics Packaging Manufacturing, IEEE Transactions onVolume 32, Issue 1, Jan. 2009 Page(s):41 - 48

4. H. Hao, Y. Shi, "Tin Whiskers with Special Morphology", Beijing University of Technology, July 2008 - Printed with permission of the authors

5. K.S. Kumar, L. Reinbold, A.F. Bower, and E. Chason, "Plastic deformation processes in Cu/Sn bimetallic films",J. Mater. Res., Vol. 23, No. 11, Nov 2008

6. P. Fontana, "SEM Images of a 27 Year Old Sample Containing Tin Whiskers in Comparison to Salt (NaCl) Whiskers", June 2008

7. P. Snugovsky, et al, "Whisker Growth on SAC Solder Joints: Microstructural Analysis", SMTA Toronto, May 2008

   	Technical Presentation
   	Technical Paper

8. E. Chason, N. Jadhav, W. L. Chan, L. Reinbold, and K. S. Kumar, "Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes", APPLIED PHYSICS LETTERS 92, 171901, April 2008

9. Courey, K.J.; Asfour, S.S.; Bayliss, J.A.; Ludwig, L.L.; Zapata, M.C., "Tin Whisker Electrical Short Circuit Characteristics—Part I", Electronics Packaging Manufacturing, IEEE Transactions on, Volume 31, Issue 1, Jan. 2008 Page(s):32 - 40

10. J. Brusse, H. Leidecker, L. Panashchenko, "Metal Whiskers: Failure Modes & Mitigation Strategies", Microelectronics Reliability & Qualification Workshop (MRQW), Dec. 2007

11. S. Barr, "Mitigating and Preventing the Growth of Tin and Other Metal Whiskers on Critical Hardware", 2007   Presentation

12. H. Leidecker, "Metal Whiskering: Tin, Zinc and Cadmium", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

13. H. Garich, "Evaluation of Faradayic Plating Method for Controlling Tin Whisker Growth", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

14. J. Aragon, "Tin Whisker Mitigation Methods", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

15. E. Chason, "Stress Generation, Relaxation and Whisker Formation in Tin Coatings on Copper", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

16. J. Doornink, "Effectiveness of EPM Coatings as a Mitigation Against Tin Whiskers", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

17. F. Dunlevey, "Evaluation of the Influence of Substrate Material on Tin Whisker Growth", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

18. M. Mason, G. Eng, "Understanding Tin Plasmas: A New Approach to Tin Plasma Risk Assessment", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

19. G. Galyon, "Tin Whisker: Stress Measurement and Analysis", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

20. C. Handwerker, "Stress Relaxation in Sn, Sn-Cu, and Sn-Pb Films", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

21. D. Hillman, "The Use of Sn-Bi Plating for Tin Whisker Mitigation on Fabricated Mechanical Parts", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

22. S. Mathew, "Tin Whisker Risk and Growth Assessment", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

23. J. Michelet, "Tin Whiskers: How to Mitigate their Growth by an Accurate Choice of the Finish, the Under-Layer and/or by Conformal Coating?", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

24. K. Nishimi, "Space Shuttle Program-Tin Whisker Mitigation", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

25. W. Boettinger, "NIST Tin Whisker Research", CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

26. K. Nocke, "Tin Whisker Growth Investigations Component and Module Level",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

27. P. Oberndorf, "Matte Tin Plating as an Alternative to Tin-Lead as Semiconductor Surface Finish",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

28. D. Pinsky, "The Effect of Grain Boundary Impurities on the Whiskering Propensity of Tin",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

29. L. Reinbold, "Intermetallic Growth Kinetics in Copper-Tin Bi-Layer Thin Films",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

30. T. Shibutani, "Evaluation of Resistance to Tin Whisker Formation Induced by Contact Force",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

31. K. Suganuma, "Tin Whisker Formation on Fine Pitch Connectors and Its Mitigation",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

32. R. Thompson, "POSS-thiol Based Mitigation of Tin Whiskers",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

33. A. Touw, "Tin Whisker Interactions:  A Monte Carlo Analysis",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

34. G. Wilcox, "Tin Whisker Growth from Electrodeposited Tin-Manganese Alloys",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

35. T. Woodrow, "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy: Part II",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

36. T. Woodrow, "Tracer Diffusion in Whisker-Prone Tin Platings",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007

37. W. Zhang, "Effects of Lead (Pb) on Tin Whisker Elimination",  CALCE Intl. Symposium on Tin Whiskers, Apr. 2007 

38. T. Woodrow, "Tracer Diffusion in Whisker-Prone Tin Platings", SMTAI, Sept. 2006

39. T. Woodrow, "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part 2", SMTAI, Sept. 2006

40. H. Leidecker, J. Brusse, "Tin Whiskers:  A History of Documented Electrical System Failures", Technical Presentation to Space Shuttle Program Office, April 2006

41.  W.J. Boettinger, "Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits", Acta Materialia 53, 2005, pp. 5033-5050.

42. V. Schroeder, "HP Experience with Tin Whisker Inspection Training", V. Schroeder, circa August 2005

43. Westinghouse Nuclear Tech Bulletin TB-05-4, "Potential Tin Whiskers on Printed Circuit Board Components", June 8, 2005

44. T. Woodrow, "Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy", IPC/JEDEC 8th International Conference on Pb-Free Electronic Components and Assemblies, San Jose, CA, April 18-20, 2005
       -  Technical Paper (~11 Mbytes)
       -  Presentation (~19 Mbytes)
45. K. Chen, G. Wilcox, "Observations of the Spontaneous Growth of Tin Whiskers on Tin-Manganese Alloy Electrodeposits", Physical Review Letters, Feb. 17, 2005, pp. 066104-1 to 066104-4
46. M. Barsoum, et al, "Driving Force and Mechanism for Spontaneous Metal Whisker Formation", Physical Review Letters 93, Nov. 10, 2004, pp.206104-1 to 206104-4
47. J. Brusse, M. Sampson, "Zinc Whiskers:  Hidden Cause of Equipment Failure", IEEE IT Professional, 2004 Nov/Dec, Vol. 6 No. 6, pp 43-47
48. I. Amato, "Tin Whiskers: The Next Y2K Problem?", Fortune Magazine, Dec. 29, 2004
49. H. Reynolds, R. Hilty, "Investigations of Zinc (Zn) Whiskers using FIB Technology", IPC/JEDEC Boston, Dec. 2004
50. "Zinc whiskers found in War Memorial", ComputerWorld-Australia, M. Crawford, Aug. 12, 2004
51. "Zinc whiskers tangle data centre ops", ComputerWorld-Australia, J. Bajkowski, Feb. 12, 2004
52. D. Pinsky, M. Osterman, S. Ganesan, "Tin Whiskering Risk Factors", IEEE Trans. on Components and Packaging Technologies, Vol. 27 No. 2, June 2004
53. M. Barsoum, E. Hoffman, et al, "Driving Force and Mechanism for Spontaneous Metal Whisker Formation", Physical Review Letters- American Physical Society, June 25, 2004
54. J. Osenbach, R. Shook, et al, "Lead-Free Packaging and Sn Whiskers", IEEE Electronic Components and Technology Conference, 2004, pp. 1314-1324.
55. A. Gurav, B. Stacy, "Whiskering Evaluation of Capacitors Mounted with Lead-Free Solders", IPC/JEDEC 5th International Conference on Lead Free Electronic Components and Assemblies, March 2004
56. W. Bjorndahl, L. Singleton, et al, "Detection of Tin Plating and Tin Whisker Mitigation", 42nd Annual Intl Reliability Physics Symposium, Phoenix, 2004, pp. 563-564.
57. G. Galyon, "A History of Tin Whisker Theory: 1946 to 2004", SMTAI International conference, September 26-30, 2004 (Chicago, IL)
58. G. Galyon, R. Gedney, "Avoiding Tin Whisker Reliability Problems", Circuits Assembly, Aug. 2004, pp. 26-31
59. R. Gedney, J. Smetana, N. Vo, G. Galyon, "NEMI Tin Whisker Projects", Second International Conference on Lead Free Electronics, June 21-23, 2004 (Amsterdam)
60. M. Dittes, P. Oberndorf, P. Crema, V. Schroeder, "Tin Whisker Formation in Thermal Cycling Conditions", IEEE Electronics Packaging and Technology Conference, 2003, pp. 183-188.
61. H. Leidecker, "Whiskers of Sn-Pb on REFLOWED Die Attach Solder Used in the Manufacture of Laser Diode Arrays", December 2003
62. GEIA G-12 Committee, "GEB-0002: Reducing the Risk of Tin Whisker-Induced Failures in Electronic Systems", December 2003
63. N. Vo, et al, "NEMI Recommends Standard Test Methods to Assess Propensity for Tin Whisker Growth", SMT Magazine, November 2003
64. J. Brusse, "A Discussion of the Significance of Metal Whisker Formation to the High Reliability Community", Nov. 2003
65. G. Galyon, "Annotated Tin Whisker Bibliography", NEMI Publication, pp. 1-22, Updated July 2003 (orig. Feb. 2003)
66. S. Lal, "Tin Whiskers and Minimization in Electrical Connectors", AESF-SUR/FIN Conference, Milwaukee, WI:  June 2003
67. S. Okada, et al, "Field Reliability Estimation of Tin Whiskers Generated by Thermal Cycling Stress", Capacitor and Resistor Technology Symposium (CARTS) Europe, October 2003

68. G. Eng., et al, "Review of Aerospace Corp. Pre- and Post-Project 1998 Tin Whisker Work", The Aerospace Corp. Internal Presentation, et al, Apr. 2003

69. J. Brusse, "Zinc Whisker Awareness:  Could Zinc Whiskers Be Impacting Your Electronics?", Technical Presentation, April 2003
70. B. Jeffers, "Capacitor Tin Whisker White Paper:  Is it Tinned Yet?", IPC/JEDEC International Pb-Free Conference, San Jose, CA, April 2003
71. P. Bush, G. Jones, I. Boguslavsky, "Relationships of Copper Diffusion and Surface Oxide Formation to Tin Whisker Growth", NEMI Workshop on Tin Whiskers, APEX 2003, Anaheim, CA, April 1, 2003
72. C. Xu, C. Fan, Y. Zhang, J. Abys, "Whisker Prevention", Proceedings of the Technical Conference, APEX 2003, Anaheim, CA, April 2003
73. A. Teverovsky, "Gold Whiskers:  Introducing a New Member to the Family", Internal NASA Goddard Memo, April 2003
74. I. Boguslavsky, P. Bush, "Recrystallization Principles Applied to Whisker Growth in Tin", APEX 2003, Anaheim, CA, March 31, 2003, pp. S12-4-1 to S12-4-10.
75. J. LeBret, M. Norton, "Electron Microscopy Study of Tin Whisker Growth", Journal of Materials Research, Vol. 18, No. 3, pp. 585-593 March, 2003
76. G. Galyon, "Annotated Tin Whisker Bibliography", NEMI Publication, pp. 1-21, February 2003
77. D. Romm, D. Abbott, S. Grenney, M. Khan, "Whisker Evaluation of Tin-Plated Logic Component Leads", Texas Instruments Application Report SZZA037A, February 2003
78. B. Chudnovsky, "Degradation of Power Contacts in Industrial Atmosphere: Silver Corrosion and Whiskers", 48th IEEE Holm Conference on Electrical Contacts 2002, pp 140 - 150.
79. S. Lal, "Tin Whiskers: Their Appearance and Reduction in Electronic Connectors", 2nd IPC-JEDEC International Conference on Pb-Free Electronic Components and Assemblies, Taipei, Taiwan, Dec. 10, 2002, pp. 107-126
80. N. Vo, M. Tsuriya, "Whisker Assessment of Tin-based Finishes for Leadframe Packages", Proceedings of EcoDesign 2003 Japan Symposium, Tokyo, Japan:  Dec. 5, 2002, pp. B-5-1, 120-123
81. A. Egli, W Zhang, J Heber, F. Schwager, M. Toben, "Where Crystal Planes Meet:  Contribution to the Understanding of the Tin Whisker Growth Process", IPC Conference (New Orleans), November 2002
82. S. Tucker, "What Nasty Little Things are Lurking Inside Your Data Center?", Unisys World Monthly, November 2002
83. J. Brusse, G. Ewell, and J. Siplon, "Tin Whiskers: Attributes and Mitigation", Capacitor and Resistor Technology Symposium (CARTS) Europe, October 15-17, 2002, pp.221-233
84. W. Blum, R. Kullman, et al "On the Scope of Whisker Risk of Pure Tin Terminated SMD-Resistors", Capacitor and Resistor Technology Symposium (CARTS) Europe, October 15-17, 2002, pp.234-238
85. G. Davy, "Relay Failure Caused by Tin Whiskers", Northrop Grumman Electronic Systems Technical Article, October 2002
86. Univ. of Maryland CALCE, "POSITION PAPER ON RISKS TO HIGH-RELIABILITY ELECTRONICS AND ASSOCIATED HARDWARE FROM PURE TIN COATINGS", July 25, 2002

87. Westinghouse Nuclear Tech Bulletin TB-02-5, "(Tin Whiskers on Potentiometers used in) Basler Power Supplies", July 12, 2002

88. M. Osterman (Univ. of Maryland CALCE), "Mitigation Strategies for Tin Whiskers", July 3, 2002
89. G. Sheng, C. Hu, et al, "Tin Whiskers Studied by Focused Ion Beam Imaging and Transmission Electron Microscopy", Journal of Applied Physics Volume 92: No. 1, 1 July 2002, pp. 64-69
90. J. Brusse, "Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, pp. 45-61
91. R. Schetty, "Tin Whisker Studies--Experimentation and Mechanistic Understanding", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, 7-17
92. R. Oberle, "Metallurgical Aspects of Tin Whisker Growth", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, pp. N/A
93. K. Whitlaw and J. Crosby, "An Empirical Study into Tin Whisker Growth of Tin and Tin Alloy Electrodeposits", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, pp.19-30, 40-42.
94. M. Williams, C. Johnson, K. Moon, G. Stafford, C. Handwerker and W. Boettinger, "Whisker Formation on Electroplated Sn-Cu", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, pp. 31-39
95. I. Boguslavsky, N. Brown and H. Gray, "The Effect of Operating Parameters and Test Conditions On the Whisker Performance of Pure Tin as a Lead-Free Solderable Finish", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, pp. N/A
96. S. Lal, "Lead-Free Coatings in High Speed Electronic Connectors", Proceedings of the American Electroplaters and Surface Finishers (AESF) SUR/FIN Conference, June 24-28, 2002, pp. 75-90
97. Univ. of Maryland CALCE, "RISKS OF CONDUCTIVE WHISKERS IN HIGH-RELIABILITY ELECTRONICS AND ASSOCIATED HARDWARE FROM PURE TIN COATINGS", June 19, 2002
98. Univ. of Maryland CALCE, "Tin Whisker Experiences", June 19, 2002
99. C. Xu, Y. Zhang, C. Fan, J. Abys, "Understanding Whisker Phenomenon:  The Driving Force for Whisker Formation", Circuit Tree Magazine, April 2002, pp. 94-105
100. J. Brusse, G. Ewell, and J. Siplon, "Tin Whiskers: Attributes and Mitigation", Capacitor and Resistor Technology Symposium (CARTS), pp. 67-80 March 25-29, 2002.
101. B. Levine, "Will 'Tin Whiskers' Grow When You Get the Lead Out?", Electronic News, March 25, 2002, pp 2.
102. R. Schetty, "Tin Whisker Growth & The Metallurgical Properties of Electrodeposited Tin", IPC/JEDEC International Conference on Lead-Free Electronic Assemblies, March 2002, pp. 137-145
103. N. Vo, "Whisker Growth Evaluations of Tin-Based Plating Finishes", JEDEX 2002 Conference, Santa Clara, CA, March 25, 2002
104. S. Lal, "Lead-Free Development of Electronic Connectors", Proceedings of the IPC SMEMA Council APEX, pp. S01-1-1 thru S01-1-14, January 2002
105. Y. Zhang, C. Xu, C. Fan, J. Abys andA. Vysotskaya, "Understanding Whisker Phenomenon: Whisker Index and Tin/Copper, Tin/Nickel Interface", Proceedings of the IPC SMEMA Council APEX, pp. S06-1-1 thru S06-1-11, January 2002
106. C. Xu, Y.Zhang, C. Fan, J. Abys, L. Hopkins, F. Stevie, "Understanding Whisker Phenomenon- Driving Force for the Whisker Formation", Proceedings of the IPC SMEMA Council APEX, pp. S06-2-1 thru S06-1-6, January 2002
107. I. Baudry, and G. Kerros, "Focused Ion Beam in Microelectronics Packaging Applications - Leadfree Plating Analysis-", Soldering & Assembly Technology, www.lead-free.org, November, 3, 2001.
108. J. S. Kadesch, and J. Brusse, "The Continuing Dangers of Tin Whiskers and Attempts to Control them with Conformal Coat", NASA's EEE Links Newsletter, July 2001
109. D. Conwell, "Zinc Whisker Shorting in Vacuum", LMAO Astronautics Mission Success, July 20, 2001. 
110. C. Stevens, "Relay Failures Induced by the Growth of Tin Whiskers:  A Case Study", IEEE Boston Reliability Chapter 38th Annual Spring Reliability Symposium, May 16, 2001
111. R. Bidin, R. Tagapulot, C. Nichelle, D. Lao and R. Manalac, "Lead-Free Packaging", Advanced Packaging on-line, May 2001.
112. S. Winkler and B. Hom, "A Look at the Past Reveals a Leadfree Drop-In Replacement", High Density Interconnect (HDI) on-line (http://www.hdi-online.com), March 2001.
113. M. Barthelmy, "TIP No. 125: Problems with Pure Tin Coatings (Revised TIP 021)", NASA GSFC Materials Engineering Branch, January 17, 2001
114. P.J. Brooks, "JC-13.2 New Business item: Addition of Matte Tin Final Lead or Terminal Finish to MIL-PRF-38535", Addendum to JC-13.2 Agenda at January 2001 Meeting, San Antonio, Texas, January 11, 2001.
115. S. Lal, "An Evaluative Study of Lead-Free Deposits in High Speed Applications, AESF SUR/FIN Conference 2001
116. Y. Zhang, C. Su, C. Fan, and J.A. Abys, "Tin Whisker Growth and Prevention", Journal of Surface Mount Technology, October, 2000.
117. H. Leidecker, and J.S. Kadesch, "Effects of Uralane Conformal Coating on Tin Whisker Growth", Proceedings of IMAPS Nordic, The 37th IMAPS Nordic Annual Conference, pp. 108-116, September, 10-13, 2000.
118. J. Kadesch, "Effects of Conformal Coat on Tin Whisker Growth", NASA's EEE Links Newsletter, March 2000
119. GE Power Management, "Technical Service Bulletin:  Tin Whiskers in MOD10 Relays", March 27, 2000
120. Space Views Article, "Mexican Satellite Failure May Be Linked to Past Problem", http://www.spaceviews.com/, August 30, 2000.
121. R. Schetty, "Minimization of Tin Whisker Formation for Lead-Free Electronics Finishing", IPC Works Conference, Miami USA, pp. s-02-3-1 - s-02-3-6, 2000.
122. Y. Zhang, "Can Electroplated Pure Tin Be Utilized as a Final Surface Finish for PWBs?", Circuitree, vol. 12, no. 11, pp. 10 - 22, November 1999.
123. M. Ishii, T. Kataoka, H. Kurihara, "Whisker Problem in the Ultra-fine Pitch Circuits," 12^th European Microelectronics & Packaging Conference, June 7 - 9, 1999.
124. Lucent Technologies Press Release, "Lucent Technologies Venture Announces Electroplating Process that Gets the Lead out of Solder Materials", http://www.lucent.com/, April 1999.
125. J. Brusse, "Tin Whiskers: Revisiting an Old Problem", NASA's EEE Links Newsletter, December 1998
126. SAE International, "Investigation of Whisker Formation on Tin Plated Conductors", SAE, AIR5444, December 1998. 
127. M. Sampson, "Tin Whiskers: Amendment", NASA Parts Advisory NA-044A, December 17, 1998
128. M. Sampson, "Tin Whiskers", NASA Parts Advisory NA-044, October 23, 1998
129. B. Nordwall, "Filter Center", Aviation Week & Space Technology, pp. 47, August 17, 1998
130. G. J. Ewell and F. Moore, "Tin Whiskers and Passive Components: A Review of the Concerns"", 18th Capacitor and Resistor Technology Symposium, March 1998.
131. B.Z. Lee and D.N. Lee, "Spontaneous Growth Mechanism of Tin Whiskers", Acta Materialogica, vol. 46, no. 10, pp. 3701-3714, 1998.
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August 11, 2020