10.  PWAs:  Lack of Stress Relief

This device failed after environmental testing as a result of not having any stress relief on the leads. Remounting of the part incorporating the proper stress relief was required.

Reference :
NASA-STD-8739.3,
4.3. Reliable Soldered Connections
2. The following requirements and design objectives should be used to ensure the reliable soldered connections required by NASA:
a. Stress relief should be inherent in the design to avoid detrimental thermal and mechanical stresses on the solder connections.