2017 NEPP Electronics Technology Workshop Available Materials
Download All in One ZIP (78MB) |
Monday, 26-June |
Time |
Title |
Presenter |
08:00 |
Registration |
THEME: Advanced Electronic Parts Technologies |
09:00 |
NEPP Technology Planning |
Ken LaBel
NEPP Co-Manager |
09:30 |
Processors (Radiation) |
Steve Guertin
JPL |
10:00 |
Graphics Processor Units (GPUs) |
Ed Wyrwas
Lentech/GSFC |
10:30 |
BREAK |
11:00 |
Field Programmable Gate Arrays (Radiation) |
Melanie Berg
AS&D/GSFC |
11:30 |
Non-Volatile Memories |
Jean Yang Scharlotta
JPL |
12:00 |
Lunch (1 Hour 30 Minutes) |
13:30 |
DDR Memories |
Ed Wyrwas
Lentech / GSFC |
THEME: Power and Widebandgap |
14:00 |
Silicon Power MOSFETs |
Jean-Marie Lauenstein
NASA/GSFC |
14:30 |
Silicon Carbide Power Devices and Integrated Circuits |
Jean-Marie Lauenstein
NASA/GSFC |
15:00 |
BREAK |
15:30 |
LET Dependence of SEB in 1200V SiC Power MOSFETs: Data and TCAD Results |
Prof. Art Witulski
Vanderbilt University |
16:00 |
Gallium Nitride Devices |
Leif Scheick
JPL |
16:30 |
Hybrid/DC-DC Status |
Peter Majewicz
NASA/LaRC |
17:00 |
End of Day 1 |
Tuesday, 27-June |
Time |
Title |
Presenter |
08:00 |
Registration |
THEME: NASA Electronic Parts Assurance Group (NEPAG) |
08:30 |
NEPP/NEPAG Overview |
Mike Sampson
NASA/GSFC |
09:00 |
Parts Standardization Activity Update |
Shri Agarwal
JPL |
09:30 |
NEPAG Capacitor and Hermetic Leak Testing Updates |
Mike Sampson
NASA/GSFC |
10:00 |
BREAK |
10:30 |
Proton Facility Update |
Ken LaBel
NEPP Co-Manager |
11:00 |
Safe Operating Area and Single Event Effects for "Schottky Diodes" |
Megan Casey
NASA/GSFC |
11:30 |
INVITED: Next Generation Class Y: Fine Pitch Flip Chip on Organic Package Technology |
Scott Popelar
Cobham |
12:00 |
Lunch (1 Hour 30 Minutes) |
THEME: EEE Parts Laboratory Capabilities |
13:30 |
Criteria Labs |
Doug Myron |
13:50 |
Integra Technologies, LLC |
Sultan Lillani |
14:10 |
Microtech Laboratories, LLC |
John Olson |
14:30 |
Golden Altos |
Tim Flaherty |
14:50 |
|
Joe Benedetto |
15:10 |
BREAK |
15:40 |
Beverly Marketing Management |
Marti McCurdy |
16:00 |
Troxel Labs |
Ian Troxel |
16:20 |
DfR Solutions |
Craig Hillman |
16:40 |
EAG Laboratories |
Aram Sarkissian |
17:00 |
End of Day 2 |
Wednesday, 28-June |
Time |
Title |
Presenter |
08:00 |
Registration |
THEME: Alternate Assurance Day |
08:30 |
Challenges for Future Space Systems |
David Davis, AFSMC |
09:00 |
CubeSat Mission Success: 2017 Update (with a closer look at the effect of process management on outcome) |
Prof. Michael Swartwout
SLU |
09:30 |
MBSE: Implications for Parts Assurance |
John Evans
NASA/HQ |
10:00 |
BREAK |
10:30 |
Reliability Assurance of CubeSat Payloads using Bayesian Nets and Radiation-Induced Fault Propagation Models |
Prof. Art Witulski
Vanderbilt University |
11:00 |
Telemetry for IC Reliability |
Robert Kwasnick, Intel |
11:30 |
Small Company Approach to Space Mission Assurance |
Cubic Aerospace |
12:00 |
Lunch (1 Hour 30 Minutes) |
13:30 |
Increasing Small Satellite Reliability -
A Public-Private Initiative |
Michael Johnson
NASA/GSFC |
14:00 |
Small Mission Radiation Hardness Assurance (RHA) |
Michael Campola
NASA/GSFC |
14:30 |
Single Event Effects (SEE) Using Classical Reliability Approach |
Melanie Berg
AS&D/GSFC |
15:00 |
BREAK |
15:30 |
SPECIAL Panel: Risk Mitigation Using Non-Military or Non-Space Grade Products |
Panel led by S. Ali Lilani, Integra Technologies, LLC.
Participants expected from across industry and government. Contact Sultan.Lilani@integra-tech.com with any questions. |
17:00 |
End of Day 3 |
Thursday, 29-June |
Time |
Title |
Presenter |
08:00 |
Registration |
THEME: Advanced Packaging |
08:30 |
3D Technology Overview |
Doug Sheldon
JPL |
09:00 |
PBGA & QFN |
Reza Ghaffarian
JPL |
09:30 |
Ultra High Density System in a Package (SiP) |
Bruce Barbara
Aurora Semiconductor |
10:00 |
BREAK |
10:30 |
DDR4 & TSC |
Jong-ook Suh
JPL |
11:00 |
Xilinx Stacked Silicon Interconnect Technology |
Raghu Chaware/Henley Liu
Xilinx |
11:30 |
Wafer Level TSV Technology |
Reza Ghaffarian
JPL |
12:00 |
Lunch (1 Hour 30 Minutes) |
THEME: HiREV |
13:30 |
TSV Integrated Package Technologies |
Hamid Eslampour
Global Foundries |
14:00 |
A Tale of Two FETs - FinFET & FDSOI |
Scott Bukofsky
Global Foundries |
14:30 |
2.5/3D Integration: A Difficult but Necessary Component of Next Gen Systems |
John Behnke
Novati |
15:00 |
Trusted Fabrication Through 3D Integration |
Paul Franzon
NCSU |
15:30 |
End of Day 4 |
End of Workshop |