The NASA Electronic Parts and Packaging Program presents:
The Official Return of MAPLD!
MAPLD 2008 will be held at the Doubletree Hotel in Annapolis, Maryland
September 15-18, 2008
If you wish to attend or present a paper at MAPLD
Click Here for Attendee Registration and Abstract Submissions!
In previous news... The NASA Electronic Parts and Packaging (NEPP) Program was proud to host the MAFA conference in Palm Beach Gardens, Florida, in lieu of MAPLD for 2007. Presentations are available here.
About The NASA Electronic Parts and Packaging (NEPP) Program
The NEPP Program generates technical knowledge and recommendations about electrical,
electronic, electromechanical (EEE) and photonic part performance, application,
failure modes, test methods, reliability and supply chain quality within the context
of NASA space flight missions and hardware. This information is made available to
the NASA and high-reliability aerospace community through publications, web pages
and links published on this website.
NEPP is sponsored by the Office of Safety and Mission Assurance and is executed
by managers Mike Sampson
and Ken LaBel at the
NASA Goddard Space Flight Center.
Parts,
Packaging,
Radiation and
Photonics are NEPP’s Focus Topics
Our technical interests within those topics are described by the following: