NASA Electronic Parts and Packaging Program

The NASA Electronic Parts and Packaging Program presents:
The Official Return of MAPLD!
MAPLD 2008 will be held at the Doubletree Hotel in Annapolis, Maryland
September 15-18, 2008

If you wish to attend or present a paper at MAPLD
Click Here for Attendee Registration and Abstract Submissions!

In previous news... The NASA Electronic Parts and Packaging (NEPP) Program was proud to host the MAFA conference in Palm Beach Gardens, Florida, in lieu of MAPLD for 2007. Presentations are available here.

About The NASA Electronic Parts and Packaging (NEPP) Program

The NEPP Program generates technical knowledge and recommendations about electrical, electronic, electromechanical (EEE) and photonic part performance, application, failure modes, test methods, reliability and supply chain quality within the context of NASA space flight missions and hardware. This information is made available to the NASA and high-reliability aerospace community through publications, web pages and links published on this website.

NEPP is sponsored by the Office of Safety and Mission Assurance and is executed by managers Mike Sampson and Ken LaBel at the NASA Goddard Space Flight Center.

Parts, Packaging, Radiation and Photonics are NEPP’s Focus Topics

Our technical interests within those topics are described by the following:

Civil Servants and NASA Contractors looking to Request an Account, please click here.