Electronic Packaging

The objective of the NEPP Electronic Packaging Project (EPAC) is to stay ahead of project requirements by 18-24 months. The primary goal of the EPAC is to expedite cutting-edge technology into missions and instruments during the Mission Formulation phases and to obtain electronics packaging information and to sustain the availability of that information for broad usage the Agency, industry, academia, and other government agencies. Specifically, the NEPP Electronic Packaging Project Objectives are to:

• Assess the reliability of newly available electronic packaging technologies for usage on NASA projects through validations, assessments, characterizations and the development of test methods/tools.
  
• Expedite infusion paths for advanced (emerging) electronic packaging technologies by evaluations of readiness for manufacturability and project usage consideration.
  
• Provide NASA projects with technology selection, application and validation guidelines for electronic packaging hardware and processes.
  
• Utilize the Information Management and Dissemination Project of the NEPP Program to retain and disseminate electronics packaging quality assurance, reliability validations, tools and availability information to the NASA community