2015 NEPP ETW Schedule |
Tuesday 23-June (Future Electronics) |
Note: Tueday's Sessions are U.S. only, on-site attendance. No WebEx |
Time |
Title |
Presenter |
8:00 AM |
Registration |
9:00 AM
|
Keynote |
Harold Bell NASA/HQ OSMA |
9:30 AM |
NEPP Roadmaps |
Ken LaBel
NASA/GSFC |
10:00 AM |
HiREV Overview |
Chris Bozada
AFRL |
10:30 AM |
Break (30 Minutes) |
11:00 AM |
Invited: The Demonstration and Qualification of a Radiation Hardened by Design 45nm CMOS Microelectronics Technology
|
Lew Cohn
NRO |
11:30 AM |
Future Needs - TBD |
Industry / Other Agencies |
12:00 PM |
Lunch
(12:00 - 1:30 PM) |
1:30 PM |
Keynote |
Dennis Andrucyk
NASA/HQ STMD |
2:00 PM |
Invited Talk |
David Davis
AFSMC |
2:30 PM |
Invited Talk |
Larry Harzstark
The Aerospace Corp |
3:00 PM |
Break (30 Minutes) |
3:30 PM |
Invited Talk: Navy Crane Capabilities |
Austin Roach
NSWC Crane |
4:00 PM
|
Materials Behavior in GaN HEMTs:
Analysis of Cross-Sectioned Devices |
Don Dorsey
AFRL |
4:30 PM |
What vs. Why: Characterization for Insight |
Michael Alles
Vanderbilt |
5:00 PM |
End of Day 1 |
Wednesday 24-June (CubeSat and Small Mission Electronics) |
Open Attendance with WebEx |
Time |
Title |
Presenter |
8:00 AM |
Registration |
8:30 AM |
S&MA Requirements for JAXA Microsatellite
Launch Opportunity Programs
|
Kouki Saiga
JAXA |
9:00 AM
|
Invited Talk: CubeSat Mission Success (or Not):
Trends and Recommendations |
Prof. Michael Swartwout
Saint Louis University |
9:30 AM |
ESA CubeSat SMA |
Jan Rautakoski
ESA |
10:00 AM |
NEPP Overview |
Mike Sampson
NASA/GSFC |
10:30 AM |
Break (30 Minutes) |
11:00 AM |
GSFC CubeSats |
Mike Johnson
NASA/GSFC |
11:30 AM |
Invited: The CubeSat Challenge
Additive Engineering for Space |
Scott Sevcik
Stratasys |
12:00 PM |
Lunch
(12:00 - 1:30 PM) |
1:30 PM |
Experience in CubeSat Missions at
Montana State University and Tyvak |
Ehson Mosleh
Tyvak |
2:00 PM |
CubeSat Parts Lists and Supply Chain
|
Kathryn Beckwith
JPL
|
2:30 PM |
CubeSat and Mobile Processors
|
Steve Guertin
JPL
|
3:00 PM |
CubeSat Power Electronics
|
Leif Scheick
JPL
|
3:30 PM |
Break (30 Minutes) |
4:00 PM |
Invited: Class D at ARC |
Steve Jara
NASA/ARC |
4:30 PM
|
Invited: NASA Parts Database |
Yuan Chen
NASA/LaRC
|
5:00 PM |
Parts and Radiation for the Uninitiated
|
Q&A Session (Panel) |
5:30 PM |
End of Day 2 |
Thursday 25-June |
Open Attendance with WebEx |
Time |
Title |
Presenter |
8:00 AM |
Registration |
8:30 AM |
Invited: Reliability and Maintainability |
John Evans
NASA/HQ OSMA |
9:00 AM
|
JESD57 Heavy Ion Standard Update
|
Jean Marie Lauenstein
NASA/GSFC |
9:20 AM |
FPGA Radiation Test Status and Plans
|
Melanie Berg
NASA/GSFC (AS&D, Inc.)
|
9:50 AM |
Zynq SOC Radiation Test Results
and Plans for the Max 10
|
Greg Allen
JPL |
10:10 AM |
Break (30 Minutes) |
10:40 AM |
Invited: EEE-INST-002 Update |
Chris Green
NASA/GSFC |
11:10 AM |
Memory and SOTA Processor Plans
|
Ken LaBel
NASA/GSFC
|
11:30 AM |
NVM Reliability Update |
Jean Yang-Scarlotta
JPL |
12:00 PM |
Lunch
(12:00 - 1:30 PM) |
1:30 PM |
Keynote |
Geoff Yoder
NASA/HQ Dep AA SMD |
2:00 PM |
GaN Devices - Update
|
Leif Scheick
JPL |
2:20 PM |
SiC - Radiation Update |
Jean Marie Lauenstein
NASA/GSFC |
2:40 PM |
Burn-In of Microcircuits |
Shri Agarwal
JPL |
3:00 PM |
Break (30 Minutes) |
3:30 PM |
NPD8730 NASA Parts Policy Update |
Peter Majewicz
NASA/LaRC |
4:00 PM |
Invited: Use of Cu Wire in Plastic Encapsulated Microcircuits - Experiment Results
|
Sultan Ali Lilani
Integra
Gary Downing
Analytical Solutions (Integra Division)
|
4:30 PM |
2015 NEPP Tasks Update for
Ceramic and Tantalum Capacitors
|
Alexander Teverovsky
NASA/GSFC (AS&D, Inc.) |
5:00 PM |
End of Day 3 |
Friday 26-June |
Open Attendance with WebEx |
Time |
Title |
Presenter |
8:00 AM |
Registration |
8:30 AM |
Special - Automotive Electronics |
Mike Sampson
NASA/GSFC |
9:00 AM
|
DC-DC Converter Update |
Peter Majewicz
NASA/LaRC |
9:30 AM |
Highly Accelerated Life Testing (HALT) Testing Update |
Rajeshuni Ramesham
JPL |
10:00 AM |
Recent CGA, PBGA/QFN Package Testing |
Reza Ghaffarian
JPL |
10:30 AM |
Break (30 Minutes) |
11:00 AM |
Xilinx V4, V5 Daisy Chain Package Testing |
Jong Ook Suh
JPL |
11:30 AM |
Results from Recent
Thermal Interface/Package in package/Flip Chip on Board
Efforts and Future Packaging Roadmap
|
Doug Sheldon
JPL |
12:00 PM |
End of Workshop |