NASA Electronic Parts and Packaging Program

NASA JPL EEE Parts Engineer 101 Training - Remote Sign-Up

You are invited to join our team at NASA for our upcoming EEE Parts 101 Training via WebEx. The meeting will open with a Parts Engineering School discussion featuring in-person presentations by senior engineering program leads from each of our university partners and the NASA Parts School team. This will be followed by tutorials given by industry experts in various areas in the field of Electronic Parts. The agenda for the training is provided below. Please let our team know if you have any questions or concerns.

Tuesday, December 5th and Wednesday, December 6th

8:00 AM to 3:00 PM (PDT)

Registration for this event is closed

Agenda (all times PDT USA)

Tuesday, December 5th Wednesday, December 6th
8:00 am - 8:15 am Training Overview
Shri Agarwal, JPL

Welcome Statement
Opening Remarks
Dr. Laurie Leshin, JPL Director
8:15 am - 10:30 am Parts Engineering School Discussion
NASA School Team
Auburn University
University of Maryland
University of Central Florida
10:40 am - 11:30 am Radiation Training
Steve McClure, JPL
11:30 am - 12:30 pm Lunch
12:30 pm - 3:00 pm EEE Parts Tutorial

JEDEC, SAE Shri Agarwal, JPL
Alternate Grade Parts Mark Porter, JPL
Failure Analysis Sultan Lilani, Integra Technologies
Silicon Carbide and Gallium Nitride Rod Deleon, Boeing
8:00 am - 8:45 am Parts History into Current State
Lyudmyla Ochs, GSFC
8:45 am - 9:30 am Basics of Failure Analysis
Lyudmyla Ochs, GSFC
9:30 am - 10:00 am Parts Number Decipher
Carlton Faller, JSC
10:00 am - 11:30 am Mil-Specs
Larry Harzstark, Aerospace Corp
11:30 am - 12:15 pm Lunch
12:15 pm - 1:00 pm Failure Mechanisms
John Evans, NASA Headquarters
Bhanu Sood, NASA Headquarters
1:00 pm - 3:00 pm Fracture Mechanics

Intro to Fracture Mechanics John Evans, NASA Headquarters
Bhanu Sood, NASA Headquarters
Fracture Mechanics Status Shri Agarwal, JPL
Nazia Ovee, JPL
FM Testing of Small Packages Scott Popelar, Frontgrade
Ben Mendoza, Golden Altos
Nazia Ovee, JPL
Findings from NESC Testing of Copper Wire Bonds Linda Del Castillo, JPL
FM Testing of Large Packages Reza Ghaffarian, JPL
Ray Kuang, Microchip
In-House Test Capabilities Sergeh Vartanian, JPL
Nazia Ovee, JPL
Gustavo Jimenez, JPL

Contact The Organizers