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Also on this page:

 Buswire Fracture from Nick in Lead
 Microcircuit ESD Damage
 Electrolytic Capacitor Leakage
 Conformal Coating Under Diode
 Excess Solder Wicking Into Sockets
 Damage from Incorrect Lead Forming
 Lead Damage From Bending Tool
 Lead Fracture from Inadequate Support
Parts and Components

Parts and Components

1. Buswire fracture due to nick in lead

2. C2 MOS capacitor ESD damage

3. Conformal coating under diode

4. Excess solder wicking up into sockets

5. Improper lead forming resulting in part damage

6. Lead damaged due to incorrect bending tool-process

7. Lead fracture due to inadequate mechanical support